FlipKYTM

Description International Rectifiers FlipKY product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The three pad 0.9mm x 1.2mm devices can deliver up to 0.5A and occupy only 1.08mm2 of board space. The anode and ca

FlipKY, 0.5 A

文件：105.65 Kbytes Page：6 Pages

chip scale packaging to deliver Schottky diodes

文件：80.94 Kbytes Page：5 Pages

FlipKY, Chip Scale Package Schottky Barrier Rectifier, 0.5 A

文件：116.7 Kbytes Page：6 Pages

Chip Scale Package Schottky Barrier Rectifier, 0.5 A

文件：95.6 Kbytes Page：5 Pages