Stacked Chip 16M Flash Memory and 4M SRAM

DESCRIPTION The LRS1331 is a combination memory organized as 1,048,576 × 16-bit flash memory and 262,144 × 16-bit static RAM in one package. FEATURES • Flash Memory and SRAM • Stacked Die Chip Scale Package • 72-ball 8 mm × 11 mm CSP plastic package • Power supply: 2.7 V to 3.6 V • Operatin

DOLBY B/C TYPE NOISE REDUCTION SYSTEM

Description The CXA1330 / CXA1331 / CXA1332 are bipolar ICs providing two separate Dolby B/C type noise reduction processors. The series is composed of five devices having three Dolby levels and two types of package for various applications.

Integrated Circuit Module - Dual, Audio Power Amplifier, 25W/Channel, 2 Power Supplies Required

Integrated Circuit Module – Dual, Audio Power Amplifier, 25W/Channel, 2 Power Supplies Required

Memory Micromodules General Information for D1, D2 and C Packaging

DESCRIPTION Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip). ■ Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: – Support for the chi

Universal Serial Bus USB Audio Playback Peripheral APP

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