Memory Micromodules General Information for D1, D2 and C Packaging

DESCRIPTION Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip). ■ Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: – Support for the chi

6-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms

DESCRIPTION The members of the ST1331/1333/1353 family are principally designed for use in prepaid Phonecard applications. Each is a 272-bit EEPROM device, with associated security logic and special fuses to control memory access. The memory is arranged as a matrix of 34 x 8 cells, accessed in

6-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms

DESCRIPTION The members of the ST1331/1333/1353 family are principally designed for use in prepaid Phonecard applications. Each is a 272-bit EEPROM device, with associated security logic and special fuses to control memory access. The memory is arranged as a matrix of 34 x 8 cells, accessed in

6-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms

DESCRIPTION The members of the ST1331/1333/1353 family are principally designed for use in prepaid Phonecard applications. Each is a 272-bit EEPROM device, with associated security logic and special fuses to control memory access. The memory is arranged as a matrix of 34 x 8 cells, accessed in

6-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms

DESCRIPTION The members of the ST1331/1333/1353 family are principally designed for use in prepaid Phonecard applications. Each is a 272-bit EEPROM device, with associated security logic and special fuses to control memory access. The memory is arranged as a matrix of 34 x 8 cells, accessed in

6-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms

DESCRIPTION The members of the ST1331/1333/1353 family are principally designed for use in prepaid Phonecard applications. Each is a 272-bit EEPROM device, with associated security logic and special fuses to control memory access. The memory is arranged as a matrix of 34 x 8 cells, accessed in

6-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms

DESCRIPTION The members of the ST1331/1333/1353 family are principally designed for use in prepaid Phonecard applications. Each is a 272-bit EEPROM device, with associated security logic and special fuses to control memory access. The memory is arranged as a matrix of 34 x 8 cells, accessed in

6-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms

DESCRIPTION The members of the ST1331/1333/1353 family are principally designed for use in prepaid Phonecard applications. Each is a 272-bit EEPROM device, with associated security logic and special fuses to control memory access. The memory is arranged as a matrix of 34 x 8 cells, accessed in

6-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms

DOLBY B/C TYPE NOISE REDUCTION SYSTEM

Description The CXA1330 / CXA1331 / CXA1332 are bipolar ICs providing two separate Dolby B/C type noise reduction processors. The series is composed of five devices having three Dolby levels and two types of package for various applications.

Stacked Chip 16M Flash Memory and 4M SRAM

DESCRIPTION The LRS1331 is a combination memory organized as 1,048,576 × 16-bit flash memory and 262,144 × 16-bit static RAM in one package. FEATURES • Flash Memory and SRAM • Stacked Die Chip Scale Package • 72-ball 8 mm × 11 mm CSP plastic package • Power supply: 2.7 V to 3.6 V • Operatin

Integrated Circuit Module - Dual, Audio Power Amplifier, 25W/Channel, 2 Power Supplies Required

Integrated Circuit Module – Dual, Audio Power Amplifier, 25W/Channel, 2 Power Supplies Required

Universal Serial Bus USB Audio Playback Peripheral APP

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