位置:ST1331 > ST1331详情

ST1331中文资料

厂家型号

ST1331

文件大小

277.48Kbytes

页面数量

13

功能描述

Memory Micromodules General Information for D1, D2 and C Packaging

数据手册

下载地址一下载地址二到原厂下载

生产厂商

STMICROELECTRONICS

ST1331数据手册规格书PDF详情

DESCRIPTION

Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip).

■ Micromodules were developed specifically for

embedding in Smartcards and Memory Cards

■ The Micromodule provides:

– Support for the chip

– Electrical contacts

– Suitable embedding interface for gluing the

module to the plastic package

■ Physical dimensions and contact positions

compliant to the ISO 7816 standard

■ Micromodules delivered as a continuous Super

35 mm tape. (This differs from the standard

35 mm tape in the spacing distance between

the indexing holes.)

ST1331产品属性

  • 类型

    描述

  • 型号

    ST1331

  • 制造商

    STMICROELECTRONICS

  • 制造商全称

    STMicroelectronics

  • 功能描述

    Memory Micromodules General Information for D1, D2 and C Packaging

更新时间:2025-10-8 9:05:00
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