位置:首页 > IC中文资料 > K3279

型号 功能描述 生产厂家 企业 LOGO 操作

KK Maxi-3.96mm & 5.08mm Modular Interconnection System

KEY FEATURES ■ Available on 3.96 mm and 5.08 mm center spacings ■ Polarisation via insertable keys and pegs ■ Allows connections anywhere on the board ■ Double cantilever style terminal ■ Selective gold plating options ■ End-to-end stacking capabilities ■ Locking ramp for improved mated ret

Molex

莫仕

Nylon Locknuts

文件:120.33 Kbytes Page:1 Pages

Heyco

BUILT-IN SERVO DRIVE INTEGRATED MOTOR-Brushless

文件:3.74534 Mbytes Page:1 Pages

ASSUN

Laser marking for EPCOS film capacitors from Nashik and Zhuhai

文件:200.59 Kbytes Page:25 Pages

TDK

东电化

6 LED ?㎩댍 IC

文件:109.8 Kbytes Page:5 Pages

BOWIN

更新时间:2025-12-26 16:30:01
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
AMP
24+
2500
TE/泰科
2508+
/
220083
一级代理,原装现货
TE
25+
100
原厂现货渠道
TE Connectivity AMP Connectors
23+
原厂封装
30430
只做原装只有原装现货实报
MOLEX
2142
全新原装 货期两周
TE/泰科
23+
NA/原装
82985
代理-优势-原装-正品-现货*期货
INTERSIL
2450+
MSOP10
6540
只做原厂原装正品终端客户免费申请样品
RICOH
06+
SSOP8
4600
全新原装进口自己库存优势
TE
500
TE
24+
con
50
现货常备产品原装可到京北通宇商城查价格

K3279数据表相关新闻

  • K32L2B31VMP0A

    K32L2B31VMP0A

    2021-6-10
  • K3RG2G20BM-AGCH

    K3RG2G20BM-AGCH SAMSUNG/三星 2020 BGA KBY00N00HA-B448 TI/德州仪器 KBY00N00HA-A448 TI/德州仪器 2020 KAV00Q013M-A447 ALLWINNER/全志 16+ BGA441 APQ8055 QUALCOMM/高通 2020 BGA K4EBE304EB-EGCF RICHTEK/立锜 2018+ QFN K4EBE324EB-EGCG RICHTEK/立锜 2018+ QFN RC2512FK-073RL RICHTEK/立锜 2020 QFN PM

    2021-5-26
  • K3RG2G20BM-AGCH

    K3RG2G20BM-AGCH SAMSUNG/三星 2020 BGA KBY00N00HA-B448 TI/德州仪器 KBY00N00HA-A448 TI/德州仪器 2020 KAV00Q013M-A447 ALLWINNER/全志 16+ BGA441 APQ8055 QUALCOMM/高通 2020 BGA K4EBE304EB-EGCF RICHTEK/立锜 2018+ QFN K4EBE324EB-EGCG RICHTEK/立锜 2018+ QFN RC2512FK-073RL RICHTEK/立锜 2020 QFN PM

    2021-5-26
  • K24C02

    K24C02,当天发货0755-82732291全新原装现货或门市自取.

    2020-10-4
  • K24C02C-SIRGA

    K24C02C-SIRGA,当天发货0755-82732291全新原装现货或门市自取.

    2020-10-2
  • K2698

    K2698,全新原装当天发货或门市自取0755-82732291.

    2019-11-14