型号 功能描述 生产厂家&企业 LOGO 操作

Heyco®LiquidTightStrainReliefBushings

TheUltimateinSnap-InStrainReliefProtection Snap-in,LowProfileDesignallowsforPre-assembledCables •Theselowprofileco-moldednylonand elastomerpartsfunctionasaLiquid TightStrainReliefwithacable. •cULusapprovedunderUL514B. •Lowprofiledesign:heightabovepan

Heyco

Heyco

Heyco

LongitudinalMeasuringPinM5forcontactfreemeasurementofcavityandinjectionpressures

•Compactinstallationsize •Contact-freemeasurementofhighpressures •Cavitypressuremeasurementbehindthecavitywall,without imprint •Indirectmeasurementofinjectionpressureinthenozzle

KISTLERKISTLER INSTRUMENT CORPORATION

奇石乐奇石乐集团

KISTLER

Inst,2Pr#18StrBC,PVC-NYLInsE1,OS,BlkPVCJkt,600VTC-ER150VNPLF90CDry/Wet

ProductDescription ULInstrumentation,2Pair18AWG(7x26)BareCopper,PVC-NYLInsulationE1ColorCode,OverallBeldfoil®Shield,BlackPVCOuterJacket,600VTC-ER 150VNPLF90CDry/WetSUNRESDIRBUR

BELDEN

Belden Inc.

BELDEN

Inst,2Pr#18StrBC,XLPEInsE1,OS,BlkLSZHPEJkt,600VTC90CDry/WetSUNRESDIRBUR

ProductDescription ULInstrumentation,2Pair18AWG(7x26)BareCopper,XLPEInsulationE1ColorCode,OverallBeldfoil®Shield,BlackLSZHPEOuterJacket,600VTC90C Dry/WetSUNRESDIRBUR

BELDEN

Belden Inc.

BELDEN

5TO1000MHzTO-8CASCADABLEAMPLIFIERS

文件:178.35 Kbytes Page:2 Pages

TELEDYNE

TELEDYNE

TELEDYNE

JR-1063产品属性

  • 类型

    描述

  • 型号

    JR-1063

  • 制造商

    TE Connectivity

更新时间:2024-5-15 13:00:02
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
HITTITE
QFN
6698
ADI/亚德诺
21+
原封装
13880
公司只售原装 支持实单
ADI/亚德诺
21+
原封装
13880
公司只售原装,支持实单
TAMAWIRA
24+
SMD
990000
明嘉莱只做原装正品现货
TAMAWIRA
2048+
SMD
9851
只做原装正品现货!或订货假一赔十!
Analog Devices
23+
EvaluationBoard
33680
ADI优势主营型号-原装正品
23+
N/A
90250
正品授权货源可靠
QORVO
22+
36000
原装现货假一赔十
TE Connectivity
2021+
标准接口
285000
专供连接器,军工合格供应商!
ADI
2019
NA
55000
原装进口假一罚十

JR-1063芯片相关品牌

  • BANNER
  • CHEMI-CON
  • CTMICRO
  • JUXING
  • LINER
  • MCC
  • Microchip
  • MINMAX
  • NEL
  • ROHM
  • SANYO
  • SEOUL

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