Features

● Silicon Chip on Direct-Copper Bond (DCB) Substrate

● Isolated Mounting Surface

● 3000V~ Electrical Isolation

● High Blocking Voltage

● High Peak Current Capability

● Low Saturation Voltage

● FBSOA Rated

● SCSOA Rated

Advantages

● Low Gate Drive Requirement

● High Power Density

Applications

● Laser Generators

● Capacitor Discharge Circuits

● AC Switches

● Protection Circuits