Features

• Silicon Chip on Direct-Copper Bond (DCB) Substrate

• Isolated Mounting Surface

• 3000V Electrical Isolation

• High Blocking Voltage

• International Standard Package

• Low Conduction Losses

Advantages

• Low Gate Drive Requirement

• High Power Density

Applications:

• Switched-Mode and Resonant-Mode Power Supplies

• Uninterruptible Power Supplies (UPS)

• Laser Generators

• Capacitor Discharge Circuits

• AC Switches