型号 功能描述 生产厂家 企业 LOGO 操作
IRKT91-16

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

Power Module 100 Amp

文件:192.19 Kbytes Page:1 Pages

TEL

STANDARD DIODES

文件:120.77 Kbytes Page:7 Pages

IRF

更新时间:2026-1-1 22:30:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
IR
24+
module
6000
全新原装正品现货 假一赔佰
IR
23+
95A1600V
362
全新原装正品,量大可订货!可开17%增值票!价格优势!
IR
NEW
模块
3562
代理全系列销售,全新原装正品,价格优势,长期供应,量大可订
ir
2023+
原厂封装
50000
原装现货
IR
23+
MODULE
7300
专注配单,只做原装进口现货
IR
23+
MODULE
7000
IR
专业模块
MODULE
8513
模块原装主营-可开原型号增税票
IR
23+
MODULE
24610
##公司主营品牌长期供应100%原装现货可含税提供技术
IR
25+
MODULE
104
就找我吧!--邀您体验愉快问购元件!
ir
24+
N/A
6980
原装现货,可开13%税票

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