型号 功能描述 生产厂家&企业 LOGO 操作
IRKT91-16AS90

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

更新时间:2025-8-9 11:22:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
IR
专业模块
MODULE
8513
模块原装主营-可开原型号增税票
IR
24+
module
6000
全新原装正品现货 假一赔佰
IR
23+
10000
原厂授权一级代理,专业海外优势订货,价格优势、品种
IR
23+
MODULE
8000
只做原装现货
IR
23+
模块
24611
##公司主营品牌长期供应100%原装现货可含税提供技术
IR
23+
模块
240
全新原装正品,量大可订货!可开17%增值票!价格优势!
IR
24+
模块
200
只做原装正品现货 欢迎来电查询15919825718
IR
22+
MODULE
6000
终端可免费供样,支持BOM配单
IR
18+
MODULE
104
就找我吧!--邀您体验愉快问购元件!
IR
23+
模块
3562

IRKT91-16AS90数据表相关新闻