型号 功能描述 生产厂家 企业 LOGO 操作
IRKT91-06AS90

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

更新时间:2025-9-28 11:34:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
IR
专业模块
MODULE
8513
模块原装主营-可开原型号增税票
IR
24+
220
现货供应
IR
24+
module
6000
全新原装正品现货 假一赔佰
IR
23+
10000
原厂授权一级代理,专业海外优势订货,价格优势、品种
IR
100
原装现货,价格优惠
IR
23+
MODULE
24603
##公司主营品牌长期供应100%原装现货可含税提供技术
IR
23+
TO-59
8510
原装正品代理渠道价格优势
IR
23+
模块
420
全新原装正品,量大可订货!可开17%增值票!价格优势!
IR
原厂封装
1000
一级代理 原装正品假一罚十价格优势长期供货
IR
23+
模块
3562

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