型号 功能描述 生产厂家&企业 LOGO 操作
IRKT91-06AS90

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

更新时间:2025-8-10 22:30:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
IR
24+
module
6000
全新原装正品现货 假一赔佰
可控硅
1950+
980
只做原装正品现货!或订货假一赔十!
IR
23+
模块
3562
IR
25+
2THY91A1
3000
全新原装、诚信经营、公司现货销售
IR
23+
TO-59
8510
原装正品代理渠道价格优势
IR
23+
MODULE
7000
IR
23+
MODULE
7300
专注配单,只做原装进口现货
IR
专业模块
MODULE
8513
模块原装主营-可开原型号增税票
IR
23+
MODULE
24603
##公司主营品牌长期供应100%原装现货可含税提供技术
IR
22+
MODULE
6000
终端可免费供样,支持BOM配单

IRKT91-06AS90数据表相关新闻