型号 功能描述 生产厂家&企业 LOGO 操作
IRKT26SLASH12AS90

ADD-A-pakTM GEN V Power Modules

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. Features ■ Hig

IRF

IRKT26SLASH12AS90

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. Features ■ Hig

IRF

IRKT26SLASH12AS90

ADD-A-pak-TM GEN V Power Modules

文件:155.55 Kbytes Page:8 Pages

IRF

IRKT26SLASH12AS90

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

文件:157.8 Kbytes Page:8 Pages

IRF

更新时间:2025-8-17 11:33:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
IR
23+
模块
3562
IR
23+
模块
16468
##公司主营品牌长期供应100%原装现货可含税提供技术
IR
23+
模块
120
全新原装正品,量大可订货!可开17%增值票!价格优势!
IR
18+
MODULE
103
就找我吧!--邀您体验愉快问购元件!
IR
22+
6000
终端可免费供样,支持BOM配单
IR
2018
模块
300
十七年VIP会员,诚信经营,一手货源,原装正品可零售!
IR
23+
MODULE
7300
专注配单,只做原装进口现货
IR
专业模块
MODULE
8513
模块原装主营-可开原型号增税票
IR
24+
模块
6430
原装现货/欢迎来电咨询
IR
23+
7000

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