ADD-A-pakTM GEN V Power Modules

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. Features ■ Hig

ADD-A-pak-TM GEN V Power Modules

文件：155.55 Kbytes Page：8 Pages

ADD-A-pakTM GEN V Power Modules

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. Features ■ Hig

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. Features ■ Hig

ADD-A-pak-TM GEN V Power Modules

文件：155.55 Kbytes Page：8 Pages

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

文件：157.8 Kbytes Page：8 Pages

Power Bridge Rectifiers

文件：93.63 Kbytes Page：2 Pages

Power Bridge Rectifiers

文件：71.5 Kbytes Page：2 Pages

3~phase

文件：261.93 Kbytes Page：3 Pages