型号 功能描述 生产厂家&企业 LOGO 操作
IRKH91/12AS90

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

ADD-A-pak GEN V Power Modules THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

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IRF

更新时间:2025-8-10 16:50:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
IR
25+23+
44519
绝对原装正品全新进口深圳现货
IR
22+
原廠原封
650
全新原装现货!自家库存!
IR
23+
模块
3562
IR
24+
module
6000
全新原装正品现货 假一赔佰
IR
23+
MODULE
7000
IR
23+
MODULE
7300
专注配单,只做原装进口现货
IR
专业模块
MODULE
8513
模块原装主营-可开原型号增税票
IR
22+
MODULE
6000
终端可免费供样,支持BOM配单
IR
23+
模块
240
全新原装正品,量大可订货!可开17%增值票!价格优势!
IR
2015
模块
300
十七年VIP会员,诚信经营,一手货源,原装正品可零售!

IRKH91/12AS90数据表相关新闻