Advanced Power MOSFET

FEATURES ■ Avalanche Rugged Technology ■ Rugged Gate Oxide Technology ■ Lower Input Capacitance ■ Improved Gate Charge ■ Extended Safe Operating Area ■ 175°C Operating Temperature ■ Lower Leakage Current : 10 μA (Max.) @ VDS = 100V ■ Lower RDS(ON) : 0.092 Ω (Typ.)

HEXFET POWER MOSFET

Description Third Generation HEXFETs from International Rectifier provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The TO-220 Fullpak eliminates the need for additional insulating hardware in commercial-industri

Power MOSFET

DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The TO-220 FULLPAK eliminates the need for additional insulating hardware in commercial-industrial applicat

Sink to Lead Creepage Distance = 4.8 mm

DESCRIPTION The TO-220 FULLPAK eliminates the need for additional insulating hardware in commercial-industrial applications. The molding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 1

Power MOSFET

DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The TO-220 FULLPAK eliminates the need for additional insulating hardware in commercial-industrial applicat

HEXFET Power MOSFET

Through-Hole Packags TO-220 FullPak (Fully Isolated)

isc N-Channel MOSFET Transistor

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Power MOSFET

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iscN-Channel MOSFET Transistor

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Power MOSFET

HEXFET POWER MOSFET

Power MOSFET

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Power MOSFET

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采用 TO-220 FullPak 封装的 100V 单 N 沟道功率 MOSFET

HEXFET짰 Power MOSFET

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ADVANCED PROCESS TECHNOLOGY

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Advanced Process Technology

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ADVANCED PROCESS TECHNOLOGY

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Pentium 4 Processors Supporting Hyper-Threading Technology

Introduction The Intel® Pentium® 4 processor on 90 nm process in the 775-land package is a follow on to the Pentium 4 processor in the 478-pin package with enhancements to the Intel NetBurst® microarchitecture. The Pentium 4 processor on 90 nm process in the 775-land package uses FlipChip Land Gr

PISTON SEALS

DESCRIPTION The BECA 530 profile is a double acting composite piston seal composed of a pre-tightened rubber square ring and a specific polyurethane friction ring. APPLICATIONS Agriculture Light and medium-sized industry Machine tools Material handling/Lifting

PISTON SEALS

DESCRIPTION The BECA 530 profile is a double acting composite piston seal composed of a pre-tightened rubber square ring and a specific polyurethane friction ring. APPLICATIONS Agriculture Light and medium-sized industry Machine tools Material handling/Lifting

PISTON SEALS

DESCRIPTION The BECA 530 profile is a double acting composite piston seal composed of a pre-tightened rubber square ring and a specific polyurethane friction ring. APPLICATIONS Agriculture Light and medium-sized industry Machine tools Material handling/Lifting

Intel짰 Solid-State Drive 530 Series (2.5-inch)

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