RoHs Compliant Containing No Lead and Bromide

Description The IRF8308MPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout

RS-232, Low Cap, #22-8pr, SR-PVC, O/A FoilBraid, PVC Jkt, CMG

Product Description Computer EIA RS-232 Cable, 22 AWG stranded (7x30) tinned copper conductors, semi-rigid PVC insulation, 8 twisted pairs, overall Beldfoil® (100 coverage) tinned copper braid shield (65 coverage), PVC jacket.

Connector Modules with Intergrated LAN Magnetics

[FILTRAN] • Unique layout conserves precious circuit board space • Designed for HUB applications • IEEE 802.3u • Compliant with a wide assortment of ICs • Primary center taps available for additional EMI reduction

RJ-45 Connector Modules with Intergrated LAN Magnetics

• Unique layout conserves precious circuit board space • Designed for HUB applications • IEEE 802.3u • Compliant with a wide assortment of ICs • Primary center taps available for additional EMI reduction

Low Skew, 1-to-8 Differential/LVCMOS-to- LVCMOS Fanout Buffer

FEATURES • Eight LVCMOS/LVTTL outputs, (7Ω typical output impedance) • Selectable LVCMOS_CLK or differential CLK, nCLK inputs • CLK, nCLK pair can accept the following differential input levels: LVPECL, LVDS, LVHSTL, SSTL, HCSL • Maximum Output Frequency: 350MHz • Output Skew: (3.3V± 5): 100

Connector Modules with Intergrated LAN Magnetics

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