HEXFET
Power MOSFET plus Schottky Diode

Description The IRF8302MPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFET® packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET® package is compatible with existing layout

Dual Sided Cooling Compatible

文件：274.13 Kbytes Page：9 Pages

Dual Sided Cooling Compatible

文件：274.13 Kbytes Page：9 Pages

LOW SKEW, 1-TO-2 LVCMOS / LVTTL FANOUT BUFFER

FEATURES • 2 LVCMOS / LVTTL outputs • LVCMOS / LVTTL clock input accepts LVCMOS or LVTTL input levels • Maximum output frequency: 200MHz • Output skew: 40ps (typical) • Part-to-part skew: 250ps (typical) • Small 8 lead SOIC package saves board space • Full 3.3V or 3.3V core, 2.5V supply mo

LOW SKEW, 1-TO-2 LVCMOS / LVTTL FANOUT BUFFER

FEATURES • 2 LVCMOS / LVTTL outputs • LVCMOS / LVTTL clock input accepts LVCMOS or LVTTL input levels • Maximum output frequency: 200MHz • Output skew: 40ps (typical) • Part-to-part skew: 250ps (typical) • Small 8 lead SOIC package saves board space • Full 3.3V or 3.3V core, 2.5V supply mo

22 AWG stranded (7x30) tinned copper conductors

文件：99.83 Kbytes Page：3 Pages

RS-232, Low Cap, #22-2pr, SR-PVC, O/A FoilBraid, PVC Jkt, CMG

文件：246.36 Kbytes Page：2 Pages

LVCMOS / LVTTL Fanout Buffer

文件：102.68 Kbytes Page：10 Pages