DirectFET Power MOSFET

Description The IRF6622PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a Micro-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layo

Ideal for CPU Core DC-DC Converters

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Four-Channel, 75 MSPS Digital Transmit Signal Processor TSP

PRODUCT DESCRIPTION The AD6622 comprises four identical digital Transmit Signal Processors (TSPs) complete with synchronization circuitry and cascadable wideband channel summation. An external digitalto-analog converter (DAC) is all that is required to complete a wide band digital up-converter. O

Four-Channel, 75 MSPS Digital Transmit Signal Processor TSP

PRODUCT DESCRIPTION The AD6622 comprises four identical digital Transmit Signal Processors (TSPs) complete with synchronization circuitry and cascadable wideband channel summation. An external digitalto-analog converter (DAC) is all that is required to complete a wide band digital up-converter. O

Four-Channel, 75 MSPS Digital Transmit Signal Processor TSP

PRODUCT DESCRIPTION The AD6622 comprises four identical digital Transmit Signal Processors (TSPs) complete with synchronization circuitry and cascadable wideband channel summation. An external digitalto-analog converter (DAC) is all that is required to complete a wide band digital up-converter. O

Four-Channel, 75 MSPS Digital Transmit Signal Processor TSP

PRODUCT DESCRIPTION The AD6622 comprises four identical digital Transmit Signal Processors (TSPs) complete with synchronization circuitry and cascadable wideband channel summation. An external digitalto-analog converter (DAC) is all that is required to complete a wide band digital up-converter. O

24 (7/32) AWG Tinned Copper

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