位置：首页 > IC中文资料 > IQOV-71-16
| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
IQOV-71-16 | OCXO Specification 文件：167.02 Kbytes Page：5 Pages | IQD |   | |
THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla | IRF | | ||
THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla | IRF | | ||
THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla | IRF | | ||
Power Module 80 Amp 文件：192.39 Kbytes Page：1 Pages | TEL 东电电子 | |
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TDK/东电化 |
23+ |
NA |
50000 |
全新原装正品现货,支持订货 |
|||
TDK |
MOUDLE |
9500 |
一级代理 原装正品假一罚十价格优势长期供货 |
||||
TDK/东电化 |
23+ |
DIP10 |
10000 |
原厂授权一级代理,专业海外优势订货,价格优势、品种 |
|||
TDK |
原厂封装 |
9800 |
原装进口公司现货假一赔百 |
||||
Sick |
24+ |
con |
2000 |
优势库存,原装正品 |
|||
TDK/东电化 |
24+ |
MOUDLE |
9600 |
原装现货,优势供应,支持实单! |
|||
TDK/东电化 |
24+ |
MOUDLE |
880000 |
明嘉莱只做原装正品现货 |
|||
INFINEON |
23+ |
SOP-8 |
7000 |
||||
TDK |
21+ |
NA |
10000 |
原装现货假一罚十 |
|||
TDK/东电化 |
21+ |
MOUDLE |
1709 |
IQOV-71-16芯片相关品牌
IQOV-71-16规格书下载地址
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DdatasheetPDF页码索引
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