型号 功能描述 生产厂家 企业 LOGO 操作
IQOV-71-16

OCXO Specification

文件:167.02 Kbytes Page:5 Pages

IQD

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

Power Module 80 Amp

文件:192.39 Kbytes Page:1 Pages

TEL

更新时间:2026-3-3 19:10:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TDK/东电化
24+
MOUDLE
880000
明嘉莱只做原装正品现货
TDK
07+
NA
20
一级代理,专注军工、汽车、医疗、工业、新能源、电力
AZOTEQ
2450+
SOT163
6540
只做原装正品现货或订货!终端客户免费申请样品!
IQS/56323
25+
1
1
TDK
25+23+
MOUDLE
10100
绝对原装正品全新进口深圳现货
TDK/东电化
22+
MOUDLE
12245
现货,原厂原装假一罚十!
INF
24+
SOP-8
700
AZOTEQ
25+
SOT23-6
15000
全新原装现货,价格优势
TDK
原厂封装
9800
原装进口公司现货假一赔百
TDK/东电化
24+
MOUDLE
54000
郑重承诺只做原装进口现货

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