CHIP MONOLITHIC CERAMIC CAPACITOR

GRM series / Hi-Cap (1uF and over) Features 1. TA chip capacitor replacement product lineup is available in X7R (X7S, X7T, X7U), X6S(X6T) and X5R temperature characteristics with a capacitance of 1uF and larger. 2. The line of high volumetric capacitance ceramic chip capacitors is available in

Ceramic Capacitors(SMD)

Specifications 180mm Paper Tape 330mm Paper Tape

System power IC

2. Features • AVCC input voltage range: 4.5V to 5.5V • DCDC converter (CH1 and CH2) Power voltage range Output voltage (*1) Output current CH1 3.6V to 5.5V 1.05V 2A CH2 4.3V to 5.5V 3.3V 2A 4.0V to 5.5V 3.3V 300mA  Synchronous Current Mode Buck Converters  Output current 2A and more

DPD Demodulator for PA Linearization, 1300MHz to 2900MHz

FEATURES (I OR Q PATH) • Wide flat performance IF BW • Wide RF and LO BWs (~ 1.6 GHz) • Ideal for Multi-Carrier Systems •Drives ADC directly • Ultra linear + 41dBmIP3O • Low Noise Figure • Excellent ACLR performance • 200 Ω output impedance • Fully integrated DPD demodulator •6x6 36 pin

Wide Input and Ultra-Low Quiescent Current Boost Converter with High Efficiency

General Description The RT4823 integrates built-in power transistors, synchronous rectification, and low supply current to provide a compact solution for systems using advanced Li-Ion battery chemistries. The RT4823 is capable of supplying significant energy when the battery voltage is lower

Ideal for Multi-Carrier Systems

FEATURES  Ideal for Multi-Carrier Systems  Lowside or Highside LO  11.8dB Gain  Ultra linear +43dBm IP3O using HS LO or +37.5 dBm IP3O using LS LO  9.7dB NF  200 Ω output impedance  Wide flat-performance IF BW  Drives ADC directly for DPD applications  Low Power Consumption  5

Ideal for Multi-Carrier Systems

FEATURES  Ideal for Multi-Carrier Systems  Lowside or Highside LO  11.7dB Gain  Ultra linear +45dBm IP3O using HS LO or +42dBm IP3O using LS LO  9.7 dB NF  200 Ω output impedance  Wide flat performance IF BW  Drives ADC directly for DPD applications  Low Power Consumption  5x5

LAUNCHXL-F28379D Overview

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400 MHz ??2700 MHz 13 dB typical max gain

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封装/外壳：0603（1608 公制） 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：CAP CER 10UF 6.3V X5R 0603 电容器 陶瓷电容器

封装/外壳：0603（1608 公制） 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：CAP CER 10UF 6.3V X5R 0603 电容器 陶瓷电容器

RF to IF Dual Downconverting Mixer

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DPD Demodulator for PA Linearization

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RF to IF Dual Downconverting Mixer

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DPD Demodulator for PA Linearization

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DRV2603 ERM/LRA Haptic Driver Evaluation Kit

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RF to IF Single Downconverting Mixer

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RF to IF Single Downconverting Mixer

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Buck-boost DC-DC converter

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Matched Broadband RF VGA

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Heterojunction Bipolar Transistor Technology (InGaP HBT)

Heterojunction Bipolar Transistor Technology (InGaP HBT)

3 MHz, 2 A Synchronous Buck Converter

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Chip Multilayer Ceramic Capacitors for General Purpose

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High-performance class-G stereo headphone amplifier with I2C volume control

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