High Current Axial Plastic Rectifier

FEATURES • Low forward voltage drop • Low leakage current, IR less than 0.1 μA • High forward current capability • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC TYPI

High Current Axial Plastic Rectifier

FEATURES • Low forward voltage drop • Low leakage current, IR less than 0.1 μA • High forward current capability • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC TYPI

High Current Axial Plastic Rectifier

FEATURES • Low forward voltage drop • Low leakage current, IR less than 0.1 μA • High forward current capability • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 TY

HIGH CURRENT PLASTIC RECTIFIER

FEATURES ♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ♦ High forward current capability ♦ Diffused junction ♦ Construction utilizes void-free molded plastic technique ♦ High surge current capability ♦ High temperature soldering guaranteed: 250°C/10 seconds,

High Current Axial Plastic Rectifier

Low forward voltage drop\nLow leakage current, IR less than 0.1 µA\nHigh forward current capability;

High Current Axial Plastic Rectifier

文件：83.31 Kbytes Page：5 Pages

High Current Axial Plastic Rectifier

FEATURES • Low forward voltage drop • Low leakage current, IR less than 0.1 μA • High forward current capability • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC TYPI

High Current Axial Plastic Rectifier

FEATURES • Low forward voltage drop • Low leakage current, IR less than 0.1 μA • High forward current capability • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC TYPI

High Current Axial Plastic Rectifier

FEATURES • Low forward voltage drop • Low leakage current, IR less than 0.1 μA • High forward current capability • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC TYPI

High Current Axial Plastic Rectifier

FEATURES • Low forward voltage drop • Low leakage current, IR less than 0.1 μA • High forward current capability • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC TYPI

封装/外壳：P600，轴向 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：DIODE GEN PURP 600V 6A P600 分立半导体产品 二极管 - 整流器 - 单

封装/外壳：P600，轴向 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：DIODE GEN PURP 600V 6A P600 分立半导体产品 二极管 - 整流器 - 单

High-speed switching diode array

DESCRIPTION The BAV756S consists of four high-speed switching diodes fabricated in planar technology, and encapsulated in the small SMD SOT363 plastic package. One pair of diodes has a common cathode; the other pair has a common anode. FEATURES • Small plastic SMD package • High switching spee

QUAD SURFACE MOUNT SWITCHING DIODE ARRAY

Features • Fast Switching Speed • Ultra-Small Surface Mount Package • For General Purpose Switching Applications • High Conductance • One BAV70 Circuit and One BAW56 Circuit In One Package • Easily Connected As Full Wave Bridge • Lead Free/RoHS Compliant (Note 3) • Green Device (Notes 4 an

High-speed switching diode array

DESCRIPTION The BAV756S consists of four high-speed switching diodes fabricated in planar technology, and encapsulated in the small SMD SOT363 plastic package. One pair of diodes has a common cathode; the other pair has a common anode. FEATURES • Small plastic SMD package • High switching spee

HIGH CURRENT LEAD MOUNTED SILICON RECTIFIERS 50-1000 VOLTS DIFFUSED JUNCTION

HIGH CURRENT LEAD MOUNTED SILICON RECTIFIERS 50–1000 VOLTS DIFFUSED JUNCTION • Current Capacity Comparable to Chassis Mounted Rectifiers • Very High Surge Capacity • Insulated Case Mechanical Characteristics: • Case: Epoxy, Molded • Weight: 2.5 grams (approximately) • Finish: All External S

SILICON HIGH CURRENT SCHOTTKY BARRIER DIODE ?쏶uperBAT?

FEATURES: • Low VF • High Current Capability APPLICATIONS: • DC - DC converters • Mobile telecomms • PCMCIA