| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS • No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s | ETCList of Unclassifed Manufacturers 未分类制造商 |   |
更新时间：2025-12-28 11:10:01
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TI/德州仪器 |
23+ |
MSOP8 |
3000 |
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、 |
|||
24+ |
N/A |
64000 |
一级代理-主营优势-实惠价格-不悔选择 |
||||
24+ |
SOP8 |
130 |
|||||
WAGO/万可 |
24+ |
原封装 |
60425 |
只做原装进口现货 |
|||
WAGO/万可 |
25+ |
原封装 |
66000 |
郑重承诺只做原装进口现货 |
|||
WAGO |
21+ |
HSOP-6J |
25 |
只做原装鄙视假货15118075546 |
|||
WAGO |
2年内 |
NA |
15000 |
英博尔原装优质现货订货渠道商 |
|||
WAGO端子 |
2022+ |
3000 |
只做原装，可提供样品 |
||||
23+ |
SOP8 |
50000 |
全新原装正品现货,支持订货 |
||||
WAGO |
25 |
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2019-9-6
DdatasheetPDF页码索引
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