General Description

Combining Fairchild’s advanced 2.5V specified PowerTrench process with state-of-the-art BGA packaging, the FDZ2553N minimizes both PCB space and RDS(ON). This common drain BGA MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, high current handling capability, ultra-low profile packaging, low gate charge, and low RDS(ON).

Features

• 9.6 A, 20 V. RDS(ON) = 14 mΩ @ VGS = 4.5 V RDS(ON) = 20 mΩ @ VGS = 2.5 V

• Occupies only 0.10 cm2 of PCB area: 1/3 the area of SO-8.

• Ultra-thin package: less than 0.70 mm height when mounted to PCB.

• ESD protection diode (note 3)

• Outstanding thermal transfer characteristics: significantly better than SO-8.

• Ultra-low Qg x RDS(ON) figure-of-merit

• High power and current handling capability

Applications

• Battery management

• Load switch

• Battery protection