SCALE-2 Plug-and-Play Drivers

Features  Plug-and-play solution  Allows parallel connection of IGBT modules  For 2-level, 3-level and multilevel topologies  Built-in isolated DC/DC power supply (master)  Fiber-optic links (master)  Built-in interface to 1SP0635D2S1(C) (slave)  Duty cycle 0...100  Dynamic Advance

SCALE-2 Plug-and-Play Drivers

Features  Plug-and-play solution  Allows parallel connection of IGBT modules  For 2-level, 3-level and multilevel topologies  Built-in isolated DC/DC power supply (master)  Fiber-optic links (master)  Built-in interface to 1SP0635D2S1(C) (slave)  Duty cycle 0...100  Dynamic Advance

Highly insulated module with Trench/Fieldstop IGBT3 and emitter controlled 3 diode

Features • Electrical features - VCES = 4500 V - IC nom = 1000 A / ICRM = 2000 A - High DC stability - High dynamic robustness - High short-circuit capability - Low VCE,sat - Trench IGBT 3 - VCE,sat with positive temperature coefficient • Mechanical features - AlSiC base plate for incre

Highly insulated module with Trench/Fieldstop IGBT4 and emitter controlled 4 diode

Features • Electrical features - VCES = 6500 V - IC nom = 1000 A / ICRM = 2000 A - Low VCE,sat • Mechanical features - Extended storage temperature down to Tstg = -55 °C - Package with enhanced insulation of 10.4 kV AC 60 s - High creepage and clearance distances - Package with CTI > 600

包装：托盘托盘 描述：IGBT MODULE 1200V 1000A 分立半导体产品 晶体管 - IGBT - 模块

IGBT High-Power Module

文件：365.7 Kbytes Page：4 Pages

IHM-B module with fast Trench/Fieldstop IGBT3 and Emitter Controlled3 diode

文件：468.06 Kbytes Page：9 Pages

封装/外壳：模块 包装：散装 描述：IHV IHM T XHP 3 3-6 5K AG-IHVB13 分立半导体产品 晶体管 - IGBT - 模块

3300 V、1000 A 单开关 IGBT 模块

IHM-B module with Trench/Fieldstop IGBT3 and Emitter Controlled3 diode

文件：471.14 Kbytes Page：9 Pages

4500 V、1000 A 单开关 IGBT 模块

IGBT Modules

IGBT High-Power Module

文件：365.7 Kbytes Page：4 Pages