封装/外壳：4-SMD，无引线 包装：卷带（TR） 描述：CRYSTAL SURFACE MOUNT 晶体，振荡器，谐振器 晶体

Wire Bondable Thin Film Resistor Arrays

FEATURES • Wire bondable • Up to 12 equal value resistors • For case see Part Dimensions table • Resistance range: 20 Ω to 1 MΩ • Excellent TCR tracking • Resistor material: tantalum nitride, self-passivating • Oxidized silicon substrate for good power dissipation • Custom values and pad

Wire Bondable Thin Film Resistor Arrays

FEATURES • Wire bondable • Up to 12 equal value resistors • For case see Part Dimensions table • Resistance range: 20 Ω to 1 MΩ • Excellent TCR tracking • Resistor material: tantalum nitride, self-passivating • Oxidized silicon substrate for good power dissipation • Custom values and pad

Wire Bondable Thin Film Resistor Arrays

FEATURES • Wire bondable • Up to 12 equal value resistors • For case see Part Dimensions table • Resistance range: 20 Ω to 1 MΩ • Excellent TCR tracking • Resistor material: tantalum nitride, self-passivating • Oxidized silicon substrate for good power dissipation • Custom values and pad

Wire Bondable Thin Film Resistor Arrays

FEATURES • Wire bondable • Up to 12 equal value resistors • For case see Part Dimensions table • Resistance range: 20 Ω to 1 MΩ • Excellent TCR tracking • Resistor material: tantalum nitride, self-passivating • Oxidized silicon substrate for good power dissipation • Custom values and pad

Wire Bondable Thin Film Resistor Arrays

FEATURES • Wire bondable • Up to 12 equal value resistors • For case see Part Dimensions table • Resistance range: 20 Ω to 1 MΩ • Excellent TCR tracking • Resistor material: tantalum nitride, self-passivating • Oxidized silicon substrate for good power dissipation • Custom values and pad