DUAL COOL??PACKAGE POWERTRENCH짰 MOSFETs

Dual Cool™ packaging technology, provides both bottom- and top-side cooling in a PQFN package. Not only is the PQFN footprint an industry standard, it provides the designer with performance flexibility. With enhanced dual path thermal performance and improved parasitics over its wire-bonded predece

N-Channel Dual CoolTM PowerTrench짰 MOSFET 60 V, 40 A, 6.3 m廓

Dual Cool™ packaging technology, provides both bottom- and top-side cooling in a PQFN package. Not only is the PQFN footprint an industry standard, it provides the designer with performance flexibility. With enhanced dual path thermal performance and improved parasitics over its wire-bonded predece

N 沟道，双 CoolTM 33 PowerTrench® MOSFET，60V，40A，6.3mΩ

N-Channel Power Trench짰 MOSFET 60 V, 22 A, 7.9 m廓

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N-Channel PowerTrench짰 MOSFET 60 V, 42 A, 7.4 m廓

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N-Channel PowerTrench짰 MOSFET 60 V, 22 A, 8.2 m廓

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