封装/外壳：0402（1005 公制） 包装：卷带（TR） 描述：FUSE CHIP 0.315A 30VDC 0402 电路保护 保险丝

100Gb Spine Switch and High Density 10Gb Leaf Switch

The X870 product family are high-density, purpose-built 100Gb switches designed for high-performance enterprise and cloud data centers. With 32 QSFP28 ports, the X870 can support a range of interface speeds, including 10Gb, 25Gb, 40Gb, 50Gb and 100Gb, all in a compact 1RU form factor. This enables

High-performance 48-port 10Gb aggregation and leaf switch

The X690 Series products are high-density, purpose-built 10Gb/100Gb switches designed for high-performance enterprise and aggregation applications. The X690 can support a range of interface speeds, including 1Gb, 10Gb, 25Gb, 40Gb, 50Gb, and 100Gb, all in a compact 1RU form factor. This enables the

Scalable advanced 10Gb aggregation switch

The X670-G2 product family provides high density 10 Gigabit Ethernet and 40 Gigabit Ethernet switching in a small 1RU form factor. With its versatile design, the X670-G2 provides high density Layer 2/3 10Gb networking with low latency cut-through switching, and IPv4 and IPv6 unicast and multicast

High-performance 24-port 10Gb aggregation switch

The X590 Series products are purpose-built 24-port 1Gb/10Gb switches designed for high-performance enterprise and aggregation applications. The X590 can also support a range of uplink interface speeds, including 10Gb, 25Gb, 40Gb, 50Gb, and 100Gb, all in a compact 1RU form factor. This enables the

Nylon PCB Supports - Imperial Spacing

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