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| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
FBP160808U121-2.5A | MULTILAYER CHIP BEAD ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO | AITSEMI 创瑞科技 |   |
更新时间：2025-9-26 14:31:00
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
24+ |
3000 |
||||||
TI |
23+ |
65480 |
|||||
FUJI |
22+ |
MOLD |
8000 |
原装正品支持实单 |
|||
TAIYO/太诱 |
SMD |
22+ |
6000 |
十年配单,只做原装 |
|||
INFINEON |
23+ |
原厂封装 |
7936 |
||||
AP |
QFN |
6688 |
15 |
现货库存 |
|||
CYSTECH/全宇昕 |
23+ |
WEFBP-03A |
89000 |
原厂授权一级代理,专业海外优势订货,价格优势、品种 |
|||
24+ |
N/A |
54000 |
一级代理-主营优势-实惠价格-不悔选择 |
||||
TAIYO/太诱 |
23+ |
SMD |
6800 |
专注配单,只做原装进口现货 |
|||
DIGISOUND |
2447 |
SMD |
100500 |
一级代理专营品牌!原装正品,优势现货,长期排单到货 |
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DdatasheetPDF页码索引
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