型号 功能描述 生产厂家&企业 LOGO 操作
FBGA

Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide.

FEATURES Cutting-edge technology and expanding package offerings provide a platform from prototype-toproduction Copper (Cu) wire interconnect method and high-volume infrastructure at all Amkor CABGA production facilities Lowest cost using Amkor standard CABGA bill of materials selection 1.

amkor

安靠封装测试

FBGA

Fine Pitch Ball Grid Array

文件:559.45 Kbytes Page:2 Pages

STATSCHIPSTATS ChipPAC, Ltd.

台湾星科金朋半导体股份有限公司

Precise, reliable, and compact spectral analyzer for Fiber Bragg Grating (FBG) sensing

APPLICATIONS  Medical (e.g. RF ablation, robotics)  Energy (e.g. battery, wind, and tidal)  Aerospace  Oil and gas  Civil structures

ADVANCEDENERGY

先进能源工业

FBGA96T.5-DC144

文件:37.04 Kbytes Page:2 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

Fine Pitch Ball Grid Array - Stacked Die

文件:559.76 Kbytes Page:2 Pages

STATSCHIPSTATS ChipPAC, Ltd.

台湾星科金朋半导体股份有限公司

FBGA产品属性

  • 类型

    描述

  • 型号

    FBGA

  • 制造商

    STATSCHIP

  • 制造商全称

    STATSCHIP

  • 功能描述

    Fine Pitch Ball Grid Array

更新时间:2025-8-8 16:12:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TOPLINE
2403+
BGA
11809
原装现货!欢迎随时咨询!
SHINKO
22+
BGA
2000
进口原装!现货库存
TOPLINE
24+
BGA
2140
全新原装!现货特价供应
WELLS-CTI
78
全新原装 货期两周
XILINX
2014+
2
公司原装现货常备库存!
FATC
24+
BGA84
5000
全新原装正品,现货销售
BaySpec,Inc
23+
NA
5000
公司只做原装,可配单
20+
BGA
2860
原厂原装正品价格优惠公司现货欢迎查询
23+
BGA
68670
##公司主营品牌长期供应100%原装现货可含税提供技术
N/A
2023+
BGA
50000
全新原装现货

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