| 型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
|---|---|---|---|---|
F1455NKGK | TXDigitalVGA 文件：2.8389 Mbytes Page：27 Pages | IDTIntegrated Device Technology, Inc. 集成器深圳市集成器件技术有限公司 |  |   |
F1455NKGK | TXDigitalVGA1400MHzto2300MHz 文件：4.94897 Mbytes Page：28 Pages | RENESASRenesas Electronics America 瑞萨瑞萨科技有限公司 |  | |
F1455NKGK | 封装/外壳：28-VQFN 裸露焊盘 包装：卷带（TR） 描述：VFQFPN 6.00X6.00X0.90 MM, 0.70MM RF/IF，射频/中频和 RFID 射频放大器 | RENESASRenesas Electronics America 瑞萨瑞萨科技有限公司 | | |
封装/外壳：28-VQFN 裸露焊盘 包装：卷带（TR） 描述：VFQFPN 6.00X6.00X0.90 MM, 0.70MM RF/IF，射频/中频和 RFID 射频放大器 | RENESASRenesas Electronics America 瑞萨瑞萨科技有限公司 | | | |
TXDigitalVGA1400MHzto2300MHz 文件：4.94897 Mbytes Page：28 Pages | RENESASRenesas Electronics America 瑞萨瑞萨科技有限公司 | | | |
TXDigitalVGA 文件：2.8389 Mbytes Page：27 Pages | IDTIntegrated Device Technology, Inc. 集成器深圳市集成器件技术有限公司 | | | |
ExtrudedAluminumEnclosures KeyFeatures: DesignedtohouseP.C.boardsorforequipmentinterfacing. SizedforstandardEurocards. P.C.boardsmounthorizontallybyslidingintointernalslotsextrudedintotheenclosure body. Ruggedbodyconstructedfromextrudedaluminumwithaminimumthicknessof.06”(1.5 mm). E | HAMMOND Hammond Manufacturing Ltd. |  | | |
ExtrudedAluminumEnclosures KeyFeatures: DesignedtohouseP.C.boardsorforequipmentinterfacing. SizedforstandardEurocards. P.C.boardsmounthorizontallybyslidingintointernalslotsextrudedintotheenclosure body. Ruggedbodyconstructedfromextrudedaluminumwithaminimumthicknessof.06”(1.5 mm). E | HAMMOND Hammond Manufacturing Ltd. | | | |
ExtrudedAluminumEnclosures KeyFeatures: DesignedtohouseP.C.boardsorforequipmentinterfacing. SizedforstandardEurocards. P.C.boardsmounthorizontallybyslidingintointernalslotsextrudedintotheenclosure body. Ruggedbodyconstructedfromextrudedaluminumwithaminimumthicknessof.06”(1.5 mm). E | HAMMOND Hammond Manufacturing Ltd. | | | |
ExtrudedAluminumEnclosures KeyFeatures: DesignedtohouseP.C.boardsorforequipmentinterfacing. SizedforstandardEurocards. P.C.boardsmounthorizontallybyslidingintointernalslotsextrudedintotheenclosure body. Ruggedbodyconstructedfromextrudedaluminumwithaminimumthicknessof.06”(1.5 mm). E | HAMMOND Hammond Manufacturing Ltd. | | | |
ExtrudedAluminumEnclosures KeyFeatures: DesignedtohouseP.C.boardsorforequipmentinterfacing. SizedforstandardEurocards. P.C.boardsmounthorizontallybyslidingintointernalslotsextrudedintotheenclosure body. Ruggedbodyconstructedfromextrudedaluminumwithaminimumthicknessof.06”(1.5 mm). E | HAMMOND Hammond Manufacturing Ltd. | | |
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
RENESAS(瑞萨)/IDT |
23+ |
QFN28(6x6) |
6000 |
||||
RENESAS(瑞萨)/IDT |
23+ |
QFN28(6x6) |
7350 |
现货供应,当天可交货!免费送样,原厂技术支持!!! |
|||
RENESAS |
22+ |
N/A |
5000 |
挂了就有,工厂库存,YX价优 |
|||
RENESAS |
23+ |
QFN |
10000 |
全新、原装 |
|||
CHINA |
22+ |
TO-8DIPCSOP |
640 |
航宇科工半导体-央企合格优秀供方! |
|||
IDT/RENESAS |
22+ |
VFQFPN |
24500 |
瑞萨全系列在售 |
|||
IDT-集成器 |
24+25+/26+27+ |
QFN-28 |
6328 |
一一有问必回一特殊渠道一有长期订货一备货HK仓库 |
|||
RENESAS(瑞萨)/IDT |
2021+ |
VFQFPN-28(6x6) |
499 |
||||
RENESAS(瑞萨)/IDT |
24+ |
VFQFPN-28(6x6) |
690000 |
支持实单/只做原装 |
|||
LED |
23+ |
589610 |
新到现货 原厂一手货源 价格秒杀代理! |
F1455NKGK芯片相关品牌
F1455NKGK规格书下载地址
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F1455NKGK数据表相关新闻
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F1892SD1200?,当天发货0755-82732291全新原装现货或门市自取.
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2019-11-15
DdatasheetPDF页码索引
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