型号 功能描述 生产厂家&企业 LOGO 操作
F1455EVSK

TXDigitalVGA

文件:2.8389 Mbytes Page:27 Pages

IDTIntegrated Device Technology, Inc.

集成器深圳市集成器件技术有限公司

IDT
F1455EVSK

TXDigitalVGA1400MHzto2300MHz

文件:4.94897 Mbytes Page:28 Pages

RENESASRenesas Electronics America

瑞萨瑞萨科技有限公司

RENESAS
F1455EVSK

包装:盒 描述:BOARD 开发板,套件,编程器 射频评估和开发套件,开发板

RENESASRenesas Electronics America

瑞萨瑞萨科技有限公司

RENESAS

ExtrudedAluminumEnclosures

KeyFeatures: DesignedtohouseP.C.boardsorforequipmentinterfacing. SizedforstandardEurocards. P.C.boardsmounthorizontallybyslidingintointernalslotsextrudedintotheenclosure body. Ruggedbodyconstructedfromextrudedaluminumwithaminimumthicknessof.06”(1.5 mm). E

HAMMONDHammond Manufacturing Company Limited

哈蒙德哈蒙德制造有限公司

HAMMOND

ExtrudedAluminumEnclosures

KeyFeatures: DesignedtohouseP.C.boardsorforequipmentinterfacing. SizedforstandardEurocards. P.C.boardsmounthorizontallybyslidingintointernalslotsextrudedintotheenclosure body. Ruggedbodyconstructedfromextrudedaluminumwithaminimumthicknessof.06”(1.5 mm). E

HAMMONDHammond Manufacturing Company Limited

哈蒙德哈蒙德制造有限公司

HAMMOND

ExtrudedAluminumEnclosures

KeyFeatures: DesignedtohouseP.C.boardsorforequipmentinterfacing. SizedforstandardEurocards. P.C.boardsmounthorizontallybyslidingintointernalslotsextrudedintotheenclosure body. Ruggedbodyconstructedfromextrudedaluminumwithaminimumthicknessof.06”(1.5 mm). E

HAMMONDHammond Manufacturing Company Limited

哈蒙德哈蒙德制造有限公司

HAMMOND

ExtrudedAluminumEnclosures

KeyFeatures: DesignedtohouseP.C.boardsorforequipmentinterfacing. SizedforstandardEurocards. P.C.boardsmounthorizontallybyslidingintointernalslotsextrudedintotheenclosure body. Ruggedbodyconstructedfromextrudedaluminumwithaminimumthicknessof.06”(1.5 mm). E

HAMMONDHammond Manufacturing Company Limited

哈蒙德哈蒙德制造有限公司

HAMMOND

ExtrudedAluminumEnclosures

KeyFeatures: DesignedtohouseP.C.boardsorforequipmentinterfacing. SizedforstandardEurocards. P.C.boardsmounthorizontallybyslidingintointernalslotsextrudedintotheenclosure body. Ruggedbodyconstructedfromextrudedaluminumwithaminimumthicknessof.06”(1.5 mm). E

HAMMONDHammond Manufacturing Company Limited

哈蒙德哈蒙德制造有限公司

HAMMOND
更新时间:2024-6-14 18:30:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
RENESAS(瑞萨)/IDT
23+
QFN28(6x6)
6000
诚信服务,绝对原装原盘
RENESAS
23+
N/A
5000
挂了就有,工厂库存,YX价优
CHINA
22+
TO-8DIPCSOP
640
航宇科工半导体-央企合格优秀供方!
IDT/RENESAS
22+
VFQFPN
24500
瑞萨全系列在售
RENESAS(瑞萨)/IDT
2021+
VFQFPN-28(6x6)
499
RENESAS(瑞萨)
23+
0-BOARD (0.00L X 0.00W X 0.000
10
全新、原装
LED
23+
589610
新到现货 原厂一手货源 价格秒杀代理!
IDT-集成器
24+25+/26+27+
QFN-28
6328
一一有问必回一特殊渠道一有长期订货一备货HK仓库
优势IDT
21+ROHS
IDT
10000
原厂授权一级代理,专业海外优势订货,价格优势、品种
RENESAS(瑞萨)/IDT
23+
QFN28(6x6)
7350
现货供应,当天可交货!免费送样,原厂技术支持!!!

F1455EVSK芯片相关品牌

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  • SANYOU
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  • Xicor

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