DUAL COOL??PACKAGE POWERTRENCH짰 MOSFETs

Dual Cool™ packaging technology, provides both bottom- and top-side cooling in a PQFN package. Not only is the PQFN footprint an industry standard, it provides the designer with performance flexibility. With enhanced dual path thermal performance and improved parasitics over its wire-bonded predece

N-Channel Enhancement MOSFET

Application « Load switch | « High Frequency Switching and ~~ Synchronous Rectification « Active Clamp in Intermediate ~~ o DC/DC Power Supplies

N-Channel Power Trench짰 MOSFET 150 V, 49 A, 18 m廓

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MP Meter Pak, main lugs, six ringed sockets, no bypass, 4 jaws, OH, UG, 800 A bus, 200 A, 240 VAC single phase 3W

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Spacial CRN plain door w/o mount.plate. H800xW600xD200 IP66 IK10 RAL7035..

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