封装/外壳：径向 包装：带盒（TB） 描述：CAP FILM 0.033UF 10% 100VDC RAD 电容器 薄膜电容器

封装/外壳：径向 包装：带盒（TB） 描述：CAP FILM 0.033UF 10% 100VDC RAD 电容器 薄膜电容器

薄膜电容

Integrated Circuit Module, Hybrid, Audio Power Amp, 40W, 2 Power Supplies Req?셝

Integrated Circuit Module, Hybrid, Audio Power Amp, 40W, 2 Power Supplies Req’d

Memory Micromodules General Information for D1, D2 and C Packaging

DESCRIPTION Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip). ■ Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: – Support for the chi

6-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms

DESCRIPTION The members of the ST1331/1333/1353 family are principally designed for use in prepaid Phonecard applications. Each is a 272-bit EEPROM device, with associated security logic and special fuses to control memory access. The memory is arranged as a matrix of 34 x 8 cells, accessed in

Photo Modules for PCM Remote Control Systems

The TSOP13.. – series are miniaturized receivers for infrared remote control systems. PIN diode and preamplifier are assembled on lead frame, the epoxy package is designed as IR filter.

Designed for application where high density insertion of components is required.

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