位置:首页 > IC中文资料第11743页 > ST1333
型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
---|---|---|---|---|
ST1333 | MemoryMicromodulesGeneralInformationforD1,D2andCPackaging DESCRIPTION MemoryCardsconsistoftwomainparts:theplasticcard,andtheembeddedMicromodule(which,inturn,carriesthesiliconchip). ■Micromodulesweredevelopedspecificallyfor embeddinginSmartcardsandMemoryCards ■TheMicromoduleprovides: –Supportforthechi | STMICROELECTRONICSSTMicroelectronics 意法半导体意法半导体(ST)集团 | ||
ST1333 | 6-ContactMemoryCardIC272-bitEEPROMwithAdvancedSecurityMechanisms DESCRIPTION ThemembersoftheST1331/1333/1353familyareprincipallydesignedforuseinprepaidPhonecardapplications.Eachisa272-bitEEPROMdevice,withassociatedsecuritylogicandspecialfusestocontrolmemoryaccess.Thememoryisarrangedasamatrixof34x8cells,accessedin | STMICROELECTRONICSSTMicroelectronics 意法半导体意法半导体(ST)集团 | ||
6-ContactMemoryCardIC272-bitEEPROMwithAdvancedSecurityMechanisms DESCRIPTION ThemembersoftheST1331/1333/1353familyareprincipallydesignedforuseinprepaidPhonecardapplications.Eachisa272-bitEEPROMdevice,withassociatedsecuritylogicandspecialfusestocontrolmemoryaccess.Thememoryisarrangedasamatrixof34x8cells,accessedin | STMICROELECTRONICSSTMicroelectronics 意法半导体意法半导体(ST)集团 | |||
6-ContactMemoryCardIC272-bitEEPROMwithAdvancedSecurityMechanisms DESCRIPTION ThemembersoftheST1331/1333/1353familyareprincipallydesignedforuseinprepaidPhonecardapplications.Eachisa272-bitEEPROMdevice,withassociatedsecuritylogicandspecialfusestocontrolmemoryaccess.Thememoryisarrangedasamatrixof34x8cells,accessedin | STMICROELECTRONICSSTMicroelectronics 意法半导体意法半导体(ST)集团 | |||
6-ContactMemoryCardIC272-bitEEPROMwithAdvancedSecurityMechanisms DESCRIPTION ThemembersoftheST1331/1333/1353familyareprincipallydesignedforuseinprepaidPhonecardapplications.Eachisa272-bitEEPROMdevice,withassociatedsecuritylogicandspecialfusestocontrolmemoryaccess.Thememoryisarrangedasamatrixof34x8cells,accessedin | STMICROELECTRONICSSTMicroelectronics 意法半导体意法半导体(ST)集团 | |||
6-ContactMemoryCardIC272-bitEEPROMwithAdvancedSecurityMechanisms DESCRIPTION ThemembersoftheST1331/1333/1353familyareprincipallydesignedforuseinprepaidPhonecardapplications.Eachisa272-bitEEPROMdevice,withassociatedsecuritylogicandspecialfusestocontrolmemoryaccess.Thememoryisarrangedasamatrixof34x8cells,accessedin | STMICROELECTRONICSSTMicroelectronics 意法半导体意法半导体(ST)集团 | |||
6-ContactMemoryCardIC272-bitEEPROMwithAdvancedSecurityMechanisms DESCRIPTION ThemembersoftheST1331/1333/1353familyareprincipallydesignedforuseinprepaidPhonecardapplications.Eachisa272-bitEEPROMdevice,withassociatedsecuritylogicandspecialfusestocontrolmemoryaccess.Thememoryisarrangedasamatrixof34x8cells,accessedin | STMICROELECTRONICSSTMicroelectronics 意法半导体意法半导体(ST)集团 | |||
6-ContactMemoryCardIC272-bitEEPROMwithAdvancedSecurityMechanisms DESCRIPTION ThemembersoftheST1331/1333/1353familyareprincipallydesignedforuseinprepaidPhonecardapplications.Eachisa272-bitEEPROMdevice,withassociatedsecuritylogicandspecialfusestocontrolmemoryaccess.Thememoryisarrangedasamatrixof34x8cells,accessedin | STMICROELECTRONICSSTMicroelectronics 意法半导体意法半导体(ST)集团 | |||
HighSpeedFuses Bussmann®FusesinAllen-BradleyDrives Thefollowingdatasheetscontaininformationobtaineddirectlyfromthemanufacturer’sinstallationinstructionmanuals.WithineachapplicationtherearespecificrequirementsthatdetailhowthePowerElectronicEquipmentshouldbeinstalledandtheprop | COOPER 科普斯株洲市科普斯科技有限公司 | |||
HighSpeedFuses Bussmann®FusesinAllen-BradleyDrives Thefollowingdatasheetscontaininformationobtaineddirectlyfromthemanufacturer’sinstallationinstructionmanuals.WithineachapplicationtherearespecificrequirementsthatdetailhowthePowerElectronicEquipmentshouldbeinstalledandtheprop | COOPER 科普斯株洲市科普斯科技有限公司 | |||
HighSpeedFuses Bussmann®FusesinAllen-BradleyDrives Thefollowingdatasheetscontaininformationobtaineddirectlyfromthemanufacturer’sinstallationinstructionmanuals.WithineachapplicationtherearespecificrequirementsthatdetailhowthePowerElectronicEquipmentshouldbeinstalledandtheprop | COOPER 科普斯株洲市科普斯科技有限公司 | |||
SMDRFManualTunableInductor 文件:134.08 Kbytes Page:2 Pages | YANTELYantel Corporation 研通高频深圳市研通高频技术有限公司 | |||
Fieldbus,24Pr#18StrTC,POIns,IS/OS,PVCJkt,CMG 文件:258.589 Kbytes Page:3 Pages | BELDEN Belden Inc. |
ST1333产品属性
- 类型
描述
- 型号
ST1333
- 制造商
STMICROELECTRONICS
- 制造商全称
STMicroelectronics
- 功能描述
6-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms
IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
XG |
2020+ |
DIP-4 |
4194 |
代理品牌,全新原装现货超低价! |
|||
KODENSHI原装 |
1437+ROHS |
DIP-4 |
9748 |
全新现货!低价支持实单!!一片起订 |
|||
LONEON正品 |
DIP-4 |
85623 |
只做原装货值得信赖 |
||||
LONEON |
22+ |
DIP-4 |
28600 |
只做原装正品现货假一赔十一级代理 |
|||
LONEON |
22+ |
DIP-4 |
90000 |
原装现货 假一赔十 |
|||
ST |
22+ |
DIP8 |
16900 |
支持样品 原装现货 提供技术支持! |
|||
XG |
22+ |
DIP-4 |
58000 |
原装现货,OEM渠道。 |
|||
LONEON |
23+ |
DIP-4 |
11735 |
只做原装 欢迎咨询 |
|||
LONEON |
21+ |
DIP-4 |
50000 |
全新原装正品现货,支持订货 |
|||
XG |
13+ |
DIP-3 |
16738 |
原装分销 |
ST1333规格书下载地址
ST1333参数引脚图相关
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- ST1240
- ST1230C
- ST12100
- ST1208
- ST1200C
- ST1200
- ST11-PC
- ST11-H
- ST1155B
- ST1155A
ST1333数据表相关新闻
ST16C550CQ
ST16C550CQ
2023-9-25ST16C2550IQ48-F
ST16C2550IQ48-F
2022-11-2ST10F275-4TX3
全新原装现货支持第三方机构验证
2022-6-18ST1230C20K0
ST1230C20K0ST1230C20KO可控硅模块现货热卖
2022-1-10ST10F269Z2Q6WTC6106原装正品,价格优势
原装正品,价格优势量大可定
2020-1-11ST16C654DCQ
ST16C654DCQ深圳市拓亿芯电子有限公司,本公司具备一般纳税人,可开16点增值税票,货源渠道保证原厂原装正品IC,诚信为本,薄利多销。
2019-3-7
DdatasheetPDF页码索引
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