型号 功能描述 生产厂家&企业 LOGO 操作
ST1333

MemoryMicromodulesGeneralInformationforD1,D2andCPackaging

DESCRIPTION MemoryCardsconsistoftwomainparts:theplasticcard,andtheembeddedMicromodule(which,inturn,carriesthesiliconchip). ■Micromodulesweredevelopedspecificallyfor embeddinginSmartcardsandMemoryCards ■TheMicromoduleprovides: –Supportforthechi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS
ST1333

6-ContactMemoryCardIC272-bitEEPROMwithAdvancedSecurityMechanisms

DESCRIPTION ThemembersoftheST1331/1333/1353familyareprincipallydesignedforuseinprepaidPhonecardapplications.Eachisa272-bitEEPROMdevice,withassociatedsecuritylogicandspecialfusestocontrolmemoryaccess.Thememoryisarrangedasamatrixof34x8cells,accessedin

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

6-ContactMemoryCardIC272-bitEEPROMwithAdvancedSecurityMechanisms

DESCRIPTION ThemembersoftheST1331/1333/1353familyareprincipallydesignedforuseinprepaidPhonecardapplications.Eachisa272-bitEEPROMdevice,withassociatedsecuritylogicandspecialfusestocontrolmemoryaccess.Thememoryisarrangedasamatrixof34x8cells,accessedin

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

6-ContactMemoryCardIC272-bitEEPROMwithAdvancedSecurityMechanisms

DESCRIPTION ThemembersoftheST1331/1333/1353familyareprincipallydesignedforuseinprepaidPhonecardapplications.Eachisa272-bitEEPROMdevice,withassociatedsecuritylogicandspecialfusestocontrolmemoryaccess.Thememoryisarrangedasamatrixof34x8cells,accessedin

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

6-ContactMemoryCardIC272-bitEEPROMwithAdvancedSecurityMechanisms

DESCRIPTION ThemembersoftheST1331/1333/1353familyareprincipallydesignedforuseinprepaidPhonecardapplications.Eachisa272-bitEEPROMdevice,withassociatedsecuritylogicandspecialfusestocontrolmemoryaccess.Thememoryisarrangedasamatrixof34x8cells,accessedin

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

6-ContactMemoryCardIC272-bitEEPROMwithAdvancedSecurityMechanisms

DESCRIPTION ThemembersoftheST1331/1333/1353familyareprincipallydesignedforuseinprepaidPhonecardapplications.Eachisa272-bitEEPROMdevice,withassociatedsecuritylogicandspecialfusestocontrolmemoryaccess.Thememoryisarrangedasamatrixof34x8cells,accessedin

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

6-ContactMemoryCardIC272-bitEEPROMwithAdvancedSecurityMechanisms

DESCRIPTION ThemembersoftheST1331/1333/1353familyareprincipallydesignedforuseinprepaidPhonecardapplications.Eachisa272-bitEEPROMdevice,withassociatedsecuritylogicandspecialfusestocontrolmemoryaccess.Thememoryisarrangedasamatrixof34x8cells,accessedin

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

6-ContactMemoryCardIC272-bitEEPROMwithAdvancedSecurityMechanisms

DESCRIPTION ThemembersoftheST1331/1333/1353familyareprincipallydesignedforuseinprepaidPhonecardapplications.Eachisa272-bitEEPROMdevice,withassociatedsecuritylogicandspecialfusestocontrolmemoryaccess.Thememoryisarrangedasamatrixof34x8cells,accessedin

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

STMICROELECTRONICS

HighSpeedFuses

Bussmann®FusesinAllen-BradleyDrives Thefollowingdatasheetscontaininformationobtaineddirectlyfromthemanufacturer’sinstallationinstructionmanuals.WithineachapplicationtherearespecificrequirementsthatdetailhowthePowerElectronicEquipmentshouldbeinstalledandtheprop

COOPER

科普斯株洲市科普斯科技有限公司

COOPER

HighSpeedFuses

Bussmann®FusesinAllen-BradleyDrives Thefollowingdatasheetscontaininformationobtaineddirectlyfromthemanufacturer’sinstallationinstructionmanuals.WithineachapplicationtherearespecificrequirementsthatdetailhowthePowerElectronicEquipmentshouldbeinstalledandtheprop

COOPER

科普斯株洲市科普斯科技有限公司

COOPER

HighSpeedFuses

Bussmann®FusesinAllen-BradleyDrives Thefollowingdatasheetscontaininformationobtaineddirectlyfromthemanufacturer’sinstallationinstructionmanuals.WithineachapplicationtherearespecificrequirementsthatdetailhowthePowerElectronicEquipmentshouldbeinstalledandtheprop

COOPER

科普斯株洲市科普斯科技有限公司

COOPER

SMDRFManualTunableInductor

文件:134.08 Kbytes Page:2 Pages

YANTELYantel Corporation

研通高频深圳市研通高频技术有限公司

YANTEL

Fieldbus,24Pr#18StrTC,POIns,IS/OS,PVCJkt,CMG

文件:258.589 Kbytes Page:3 Pages

BELDEN

Belden Inc.

BELDEN

ST1333产品属性

  • 类型

    描述

  • 型号

    ST1333

  • 制造商

    STMICROELECTRONICS

  • 制造商全称

    STMicroelectronics

  • 功能描述

    6-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms

更新时间:2024-4-27 9:16:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
XG
2020+
DIP-4
4194
代理品牌,全新原装现货超低价!
KODENSHI原装
1437+ROHS
DIP-4
9748
全新现货!低价支持实单!!一片起订
LONEON正品
DIP-4
85623
只做原装货值得信赖
LONEON
22+
DIP-4
28600
只做原装正品现货假一赔十一级代理
LONEON
22+
DIP-4
90000
原装现货 假一赔十
ST
22+
DIP8
16900
支持样品 原装现货 提供技术支持!
XG
22+
DIP-4
58000
原装现货,OEM渠道。
LONEON
23+
DIP-4
11735
只做原装 欢迎咨询
LONEON
21+
DIP-4
50000
全新原装正品现货,支持订货
XG
13+
DIP-3
16738
原装分销

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