Digital Media System-on-Chip (DMSoC)

文件：1.46043 Mbytes Page：208 Pages

Digital Media System-on-Chip (DMSoC)

文件：1.45672 Mbytes Page：208 Pages

封装/外壳：338-LFBGA 包装：托盘 描述：IC SOC DIGITAL MEDIA 338NFBGA 集成电路（IC） DSP（数字信号处理器）

Digital Media System-on-Chip (DMSoC)

368 Series Card Edge Connector | Green | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | Modular | 0.630 (16.00mm) Insulator Height

Features .156 (3.96mm) Contact Spacing x .200 (5.08mm) Row Spacing Accepts .062 (1.57mm) Nominal Thickness P.C. Board High Profile Insulator Body, .630 (16.00mm) Press Fit Contact Termination Option include .031 (0.79mm) Square Wire & P. C. Tails Modular Design permits any Connector Lengt

ADC368x 18-bit 0.5 to 65-MSPS Low Noise Ultra-low Power Dual Channel ADC

1 Features • Dual channel ADC • 18-bit 10, 25, 65 MSPS ADC • Noise floor: -160 dBFS/Hz • Low power and optimized power scaling: 53 mW/ch (10 MSPS) to 94 mW/ch (65 MSPS) • Latency: 1-2 clock cycles • 18-bit, no missing codes • INL/DNL: ±7/ ±0.7 LSB (typical) • Reference: external or intern

ADC368x 18-bit 0.5 to 65-MSPS Low Noise Ultra-low Power Dual Channel ADC

文件：5.03782 Mbytes Page：75 Pages

ADC368x 18-bit 0.5 to 65-MSPS Low Noise Ultra-low Power Dual Channel ADC

文件：5.01183 Mbytes Page：75 Pages

ADC368x 18-bit 0.5 to 65-MSPS Low Noise Ultra-low Power Dual Channel ADC

文件：4.43597 Mbytes Page：73 Pages