型号 功能描述 生产厂家 企业 LOGO 操作

Dual Inline Pack Reed Relay

FEATURES Solid Epoxy Body Industry standard DIP spacing Completely sealed, Immersion cleanable Automatic insertion compatible Magnetic shield available Diode accross the coil available UL recognized and certified for Canada

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PRODUCT SPECIFICATION

Features 1. Molded epoxy body. 2. Dip type construction with the same terminal pitch as ICs or TTLs simplifies PC board designing. In addition, the high sensitivity allows direct driving by TTL, etc. 3. Automatic insertion compatible. 4. Sealed construction permits automatic flow solde

COSMO

冠西电子

Single Inline Pack Reed Relay

FEATURES ● Solid Epoxy Body ● Industry standard SIP spacing ● Completely sealed, Immersion cleanable ● Automatic insertion compatible ● Magnetic shield available ● Diode accross the coil available ● UL recognized and certified for Canada

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更新时间:2025-12-30 10:32:01
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
SAMSUNG
22+
DIP
20000
只做原装 品质保障
SAMSUNG/三星
24+
DIP
37935
郑重承诺只做原装进口现货
SAMSUNG
24+
TSOP
5000
只做原装公司现货
SAMSUNG
26+
DIP
360000
原装现货
SAMSUNG/三星
2402+
DIP24
8324
原装正品!实单价优!
SAMSUNG
23+24
DIP32
28950
原装现货.优势热卖.终端BOM表可配单
SAMSUNG
22+
TSOP
3000
原装正品,支持实单
SAM
04
QFP
200
普通
SAMSUNG/三星
2450+
DIP32
6540
只做原厂原装正品现货或订货!终端工厂可以申请样品!
24+
QFP48
9860
原装现货/放心购买

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