Programmable Unijunction Transistor

PROCESS DETAILS Process PLANAR PASSIVATED Die Size 27.5 x 27.5 MILS Die Thickness 11 MILS Anode Bonding Pad Area 7.1 x 5.1 MILS Cathode Bonding Pad Area 7.1 x 5.1 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 13,000Å

直流升压稳压电路

深圳芯能科技推出直流升压稳压电路CP6242。输入电压范围可由最低0.8伏特到最高6伏特，输出电压2.0--20V可调整且内部MOS输出开关电流可高达3A，非常适合于数码便携产品电池供电，3G网络产品，数码相机，LCD液晶屏背光电路，太阳能照明路灯，网络通讯等产品的电压转换。 \r\n\r\n CP6242应用电路非常简单，外围器件极少。振荡频率450K，该电路具有短路保护，过热保护等功能，具有更高的可靠性，安全性！

Chip Form: Programmable UJT

Silicon Rectifier Fast Recovery, Dual, Center Tap

Description: The NTE623 and NTE624 are dual, fast recovery silicon rectifiers in a TO220 type package designed for special applications such as DC power supplies, inverters, converters, ultrasonic systems, choppers and low RF interference. Features: Low Forward Voltage High Current C

High performance low power FM IF system with high-speed RSSI

DESCRIPTION The SA624 is pin-to-pin compatible with the SA604A, but has faster RSSI rise and fall time. The SA624 is an improved monolithic low-power FM IF system incorporating two limiting intermediate frequency amplifiers, quadrature detector, muting, logarithmic received signal strength indica

High performance low power FM IF system with high-speed RSSI

DESCRIPTION The SA624 is pin-to-pin compatible with the SA604A, but has faster RSSI rise and fall time. The SA624 is an improved monolithic low-power FM IF system incorporating two limiting intermediate frequency amplifiers, quadrature detector, muting, logarithmic received signal strength indica

8/16-Bit Micros

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REAL TIME EMULATION DEVELOPMENT TOOLS FOR ST6 MCU FAMILY

GENERAL DESCRIPTION The ST6 Real Time Development System is an advanced hardware development system designed and configured to provide comprehensive support for the ST6 family of MCUs. HARDWARE FEATURES ■ Supports ST62 and ST63 family ■ Real time emulation ■ 32 KBytes of emulation memory ■ B