包装：散装 描述：SCREWDRIVER,#2X8\ 工具 螺丝和螺母起子

PELTIER MODULE

DESCRIPTION: PELTIER MODULE FEATURES • solid state device • 2-stage cooler • precise temperature control • quiet operation

Power Transistor NPN - Silicon Power Transistor Chip

PROCESS DETAILS Die Size 68 x 68 MILS Die Thickness 9.5 MILS Base Bonding Pad Area 18 x 11 MILS Emitter Bonding Pad Area 18 x 12 MILS Top Side Metalization Al - 45,000Å Back Side Metalization Ti/Ni/Ag - (3000Å, 10,000Å, 10,000Å)

PELTIER MODULE

DESCRIPTION: PELTIER MODULE FEATURES • solid state device • 2-stage cooler • precise temperature control • quiet operation

Power Transistor 4.0 Amp NPN Silicon Power Transistor Chip

PROCESS DETAILS Die Size 105 x 105 MILS Die Thickness 9.5 MILS Base Bonding Pad Area 32 x 22 MILS Emitter Bonding Pad Area 33 x 24 MILS Top Side Metalization Al - 45,000Å Back Side Metalization Ti/Ni/Ag - (3000Å, 10,000Å, 10,000Å)

Power Transistor 8.0 Amp NPN Silicon Power Transistor Chip

PROCESS DETAILS Die Size 130 x 130 MILS Die Thickness 9.5 MILS Base Bonding Pad Area 37 x 20 MILS Emitter Bonding Pad Area 38 x 20 MILS Top Side Metalization Al - 45,000Å Back Side Metalization Ti/Ni/Ag - (3000Å, 10,000Å, 10,000Å)

Power Transistors 8.0 Amp NPN - High Voltage Transistor Chip

PROCESS DETAILS Die Size 167 x 167 MILS Die Thickness 9.5 MILS Base Bonding Pad Area 59 x 29 MILS Emitter Bonding Pad Area 64 x 28 MILS Top Side Metalization Al - 45,000Å Back Side Metalization Ti/Ni/Ag - 3,000Å, 10,000Å, 10,000Å

电容触摸按键 / 可编程，PWM控制器，SOC，UART

电容触摸按键 / 可编程，PWM控制器，SOC，UART

电容触摸按键 / 可编程，PWM控制器，SOC，UART

包装：散装 描述：PELTIER, 30 X 30 X 7.2 MM, 8.5 A 风扇，热管理 热 - 热电、Peltier 模块

NPN - Power Transistor Die 1.5 Amp, 400 Volt

文件：400.08 Kbytes Page：4 Pages

NPN - Darlington Transistor Die 20 Amp, 120 Volt

文件：544.72 Kbytes Page：5 Pages