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CP287

Power Transistor 8.0 Amp NPN Silicon Power Transistor Chip

PROCESS DETAILS Die Size 130 x 130 MILS Die Thickness 9.5 MILS Base Bonding Pad Area 37 x 20 MILS Emitter Bonding Pad Area 38 x 20 MILS Top Side Metalization Al - 45,000Å Back Side Metalization Ti/Ni/Ag - (3000Å, 10,000Å, 10,000Å)

CENTRAL

CP287

Power Transistor 8.0 Amp NPN Silicon Power Transistor Chip

CENTRAL

Chip Form: Power Transistor Central Semiconductor

CENTRAL

NPN - Darlington Transistor Die 20 Amp, 120 Volt

文件:544.72 Kbytes Page:5 Pages

CENTRAL

Silicon Complementary Transistors High Voltage, General Purpose Amplifier

Silicon Complementary Transistors High Voltage, General Purpose Amplifier

NTE

Square Type

文件:30.88 Kbytes Page:1 Pages

PANASONIC

松下

JFET-INPUT OPERATIONAL AMPLIFIERS

文件:259.17 Kbytes Page:20 Pages

TI

德州仪器

JFET-INPUT OPERATIONAL AMPLIFIERS

文件:259.17 Kbytes Page:20 Pages

TI

德州仪器

JFET-INPUT OPERATIONAL AMPLIFIERS

文件:259.17 Kbytes Page:20 Pages

TI

德州仪器

CP287产品属性

  • 类型

    描述

  • Case:

    Chip_Packaging

  • Configuration/ Description:

    Bare die 129.920 X 129.920

  • Polarity:

    NPN

  • IC MAX:

    8A

  • PD MAX:

    80W

  • VCEO MAX:

    400V

  • hFE MIN:

    8

  • hFE MAX:

    60

  • @VCE:

    5V

  • VCE(SAT) MAX:

    2V

  • @IC:

    5A

  • @IB:

    1A

  • Cob TYP:

    100pF

  • fT MIN:

    4MHz

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