Power Transistor NPN - Amp/Switch Transistor Chip

PROCESS DETAILS Process MULTI EPITAXIAL PLANAR Die Size 203 x 227 MILS Die Thickness 12.5 ± 1.0 MILS Base Bonding Pad Area 38 x 76 MILS Emitter Bonding Pad Area 47 x 72 MILS Top Side Metalization Al - 50,000Å Back Side Metalization Ag - 10,000Å

包装：散装 描述：ASSEMBLYROUND1 POS49.9MM (D)13.0 光电器件 光学 - 镜头

包装：托盘 描述：ASSEMBLYROUND1 POS49.9MM (D)13.1 光电器件 光学 - 镜头

光电附件

光电附件

Sensor pack 900

• Triple-axis analog accelerometer - for measuring motion and tilt • Force sensitive resistor - for sensing pressure/force • Temperature sensor - for measuring from -40 to over +125 degrees C • 10K breadboard potentiometer • Hall effect sensor - for sensing a magnet • Magnet - for use with th

RUGGED & LIGHTWEIGHT ALUMINUM BATTERY HOLDERS

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RUGGED and LIGHTWEIGHT ALUMINUM BATTERY HOLDERS

文件：115.71 Kbytes Page：2 Pages

Autotransformer Step Up - Plug In

文件：259.769 Kbytes Page：1 Pages

Autotransformer Step Up - Plug In

文件：259.769 Kbytes Page：1 Pages