位置：首页 > IC中文资料 > CL0480-0879-000
| 型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
|---|---|---|---|---|
CL0480-0879-000 | 0.3mmPitch,0.5mmStackingHeight,FullyArmored,HybridFPC-to-BoardConnector Features 1.UltraLow-profileand Space-savingDesign Compactdesignidealformobiledevices. ・Stackingheight:0.5mm,Pitch:0.3mm,Depth:1.7mm 2.RobustDesign Fullyarmoredguidespreventhousingdamage duetomisalignmentwhenmating. 3.DimpledContactLockDesign forHighExtra | HIROSEHirose Electric Company 广濑日本广濑电机株式会社 |  |   |
更新时间：2025-5-12 17:12:00
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
GAUSSTEK/丰晶 |
23+ |
DIP |
36000 |
只做原装正品原盒原包装更多现货库存 |
|||
GENERAL ELECTRIC |
23+ |
SMD |
880000 |
明嘉莱只做原装正品现货 |
|||
MECINTERNATI |
24+/25+ |
9500 |
原装正品现货库存价优 |
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DdatasheetPDF页码索引
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