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| 型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
|---|---|---|---|---|
CGY887 | 870 MHz, 21.5 dB gain push-pull amplifier DESCRIPTION Hybrid dynamic range amplifier module in a SOT115J package operating with a voltage supply of 24 V (DC), employing both GaAs and Si dies. FEATURES • Superior linearity • Extremely low noise • Rugged construction • Gold metallization ensures excellent reliability • Excellent gain | Philips 飞利浦 |   | |
RF Manual 16th edition | ETC 知名厂家 | ETC | | |
CATV amplifier module DESCRIPTION Hybrid dynamic range amplifier module in a SOT115J package operating with a voltage supply of 24 V (DC), employing both GaAs and Si dies. FEATURES • High gain • Superior linearity • Extremely low noise • Rugged construction • Gold metallization ensures excellent reliability. AP | Philips 飞利浦 | | ||
860 MHz, 25.5 dB gain push-pull amplifier DESCRIPTION Hybrid dynamic range amplifier module in a SOT115J package operating with a voltage supply of 24 V (DC), employing both GaAs and Si dies. FEATURES • High gain • Superior linearity • Extremely low noise • Rugged construction • Gold metallization ensures excellent reliability. AP | JMNIC 锦美电子 | | ||
860 MHz, 27.8 dB gain push-pull amplifier DESCRIPTION Hybrid dynamic range amplifier module in a SOT115J package operating at a voltage supply of 24 V (DC), employing both GaAs and Si dies. FEATURES • Excellent linearity • High gain • Extremely low noise • Excellent return loss properties • Rugged construction • Gold metallization | Philips 飞利浦 | | ||
RF Manual 16th edition | ETC 知名厂家 | ETC | | |
860 MHz, 27.8 dB gain push-pull amplifier 文件：56.45 Kbytes Page：8 Pages | JMNIC 锦美电子 | | ||
887 Series High Temp Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator Features 0.156 (3.96mm) Contact Spacing by 0.200 (5.08mm) Row Spacing Accepts .062 (1.57mm) Nominal Thickness P.C. Board High Profile Insulator Body, .600 (15.24mm) Card Slot Depth of .330 (8.38mm) Contact Termination Options include P.C. Tail, Wire Hole, Wire Wrap, 90 and Extender Board Bend | EDACEDAC, All Rights Reserved. 亚得电子亚得电子（东莞）有限公司 | | ||
Model 888,887 18&20 pin Dual In-Line Thick Film Resistor Network 文件：225.55 Kbytes Page：2 Pages | ETC1List of Unclassifed Manufacturers etc未分类制造商未分类制造商 | | ||
boxes and ancillary products 文件：3.51246 Mbytes Page：5 Pages | ETCList of Unclassifed Manufacturers 未分类制造商 | | ||
7.1 CHANNEL HIGH DEFINITION AUDIO CODEC TWO INDEPENDENT SPDIF-OUT 文件：996.64 Kbytes Page：82 Pages | REALTEK 瑞昱 | | ||
7.1 CHANNEL HIGH DEFINITION AUDIO CODEC TWO INDEPENDENT SPDIF-OUT 文件：996.64 Kbytes Page：82 Pages | REALTEK 瑞昱 | |
CGY887产品属性
- 类型
描述
- 型号
CGY887
- 制造商
PHILIPS
- 制造商全称
NXP Semiconductors
- 功能描述
870 MHz, 21.5 dB gain push-pull amplifier
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
恩XP |
23+ |
SOT115 |
10000 |
原厂授权一级代理,专业海外优势订货,价格优势、品种 |
|||
恩XP |
25+ |
SOT115 |
880000 |
明嘉莱只做原装正品现货 |
|||
PHI |
23+ |
TO-59 |
8510 |
原装正品代理渠道价格优势 |
|||
PHI |
24+ |
CATV |
325 |
||||
恩XP |
25+ |
电联咨询 |
7800 |
公司现货,提供拆样技术支持 |
|||
恩XP |
22+ |
SOT115J |
9000 |
原厂渠道,现货配单 |
|||
PHI |
23+ |
1688 |
房间现货库存:QQ:373621633 |
||||
PHI |
2022 |
5000 |
全新原装现货热卖 |
||||
恩XP |
24+ |
SOT115J |
53200 |
一级代理/放心采购 |
|||
恩XP |
23+ |
模块 |
3562 |
CGY887规格书下载地址
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