型号 功能描述 生产厂家 企业 LOGO 操作
CGY887

870 MHz, 21.5 dB gain push-pull amplifier

DESCRIPTION Hybrid dynamic range amplifier module in a SOT115J package operating with a voltage supply of 24 V (DC), employing both GaAs and Si dies. FEATURES • Superior linearity • Extremely low noise • Rugged construction • Gold metallization ensures excellent reliability • Excellent gain

Philips

飞利浦

CGY887

870 MHz, 21.5 dB gain push-pull amplifier

ETC

知名厂家

CATV amplifier module

DESCRIPTION Hybrid dynamic range amplifier module in a SOT115J package operating with a voltage supply of 24 V (DC), employing both GaAs and Si dies. FEATURES • High gain • Superior linearity • Extremely low noise • Rugged construction • Gold metallization ensures excellent reliability. AP

Philips

飞利浦

RF Manual 16th edition

ETC

知名厂家

860 MHz, 25.5 dB gain push-pull amplifier

DESCRIPTION Hybrid dynamic range amplifier module in a SOT115J package operating with a voltage supply of 24 V (DC), employing both GaAs and Si dies. FEATURES • High gain • Superior linearity • Extremely low noise • Rugged construction • Gold metallization ensures excellent reliability. AP

JMNIC

锦美电子

RF Manual 16th edition

ETC

知名厂家

860 MHz, 27.8 dB gain push-pull amplifier

DESCRIPTION Hybrid dynamic range amplifier module in a SOT115J package operating at a voltage supply of 24 V (DC), employing both GaAs and Si dies. FEATURES • Excellent linearity • High gain • Extremely low noise • Excellent return loss properties • Rugged construction • Gold metallization

Philips

飞利浦

860 MHz, 25.5 dB gain push-pull amplifier

ETC

知名厂家

860 MHz, 27.8 dB gain push-pull amplifier

ETC

知名厂家

860 MHz, 27.8 dB gain push-pull amplifier

文件:56.45 Kbytes Page:8 Pages

JMNIC

锦美电子

887 Series High Temp Card Edge Connector | Black | 0.156 (3.96mm) Pitch | 0.200 (5.08mm) Row Spacing | High Profile Insulator

Features 0.156 (3.96mm) Contact Spacing by 0.200 (5.08mm) Row Spacing Accepts .062 (1.57mm) Nominal Thickness P.C. Board High Profile Insulator Body, .600 (15.24mm) Card Slot Depth of .330 (8.38mm) Contact Termination Options include P.C. Tail, Wire Hole, Wire Wrap, 90 and Extender Board Bend

EDAC

亚得电子

Model 888,887 18&20 pin Dual In-Line Thick Film Resistor Network

文件:225.55 Kbytes Page:2 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

boxes and ancillary products

文件:3.51246 Mbytes Page:5 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

7.1 CHANNEL HIGH DEFINITION AUDIO CODEC TWO INDEPENDENT SPDIF-OUT

文件:996.64 Kbytes Page:82 Pages

REALTEK

瑞昱

7.1 CHANNEL HIGH DEFINITION AUDIO CODEC TWO INDEPENDENT SPDIF-OUT

文件:996.64 Kbytes Page:82 Pages

REALTEK

瑞昱

CGY887产品属性

  • 类型

    描述

  • 型号

    CGY887

  • 制造商

    PHILIPS

  • 制造商全称

    NXP Semiconductors

  • 功能描述

    870 MHz, 21.5 dB gain push-pull amplifier

更新时间:2025-12-26 18:04:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
SIEMENS
23+
SOP
5700
绝对全新原装!现货!特价!请放心订购!
PHI
25+
模块
18000
原厂直接发货进口原装
PHI
25+
2650
原装优势!绝对公司现货
恩XP
25+
SOT115
880000
明嘉莱只做原装正品现货
恩XP
NEW
模块
3562
代理全系列销售, 全新原装正品,价格优势,长期供应,量大可订
PHI
24+
CATV
325
恩XP
23+
SOT115
10000
原厂授权一级代理,专业海外优势订货,价格优势、品种
SIEMENS
24+
SOP
6980
原装现货,可开13%税票
PHI
23+
TO-59
8510
原装正品代理渠道价格优势
PHI
24+
355
现货供应

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