丝印代码：CD4502B；CMOS Strobed Hex Inverter/Buffer

Features: 2 TTL-load output drive capability 3-state outputs Common output-disable control Inhibit control = 100% tested for quiescent current at 20 V 5-V, 10-V, and 15-V parametric ratings Maximum input current of 1 4A at 18 V over full package-temperature range; 100 nA at 18 V

丝印代码：CD4502B；CMOS Strobed Hex Inverter/Buffer

Features: 2 TTL-load output drive capability 3-state outputs Common output-disable control Inhibit control = 100% tested for quiescent current at 20 V 5-V, 10-V, and 15-V parametric ratings Maximum input current of 1 4A at 18 V over full package-temperature range; 100 nA at 18 V

封装/外壳：16-SOIC（0.209"，5.30mm 宽） 包装：卷带（TR） 描述：IC BUFFER INVERT 18V 16SO 集成电路（IC） 缓冲器，驱动器，接收器，收发器

CMOS Strobed Hex Inverter/Buffer

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CMOS Strobed Hex Inverter/Buffer

文件：1.12343 Mbytes Page：15 Pages

Strobed hex inverter/buffer

The HEF4502B consists of six inverter/buffers with 3-state outputs. When the output enable input (EO) is HIGH all six outputs (O1to O6) are in the high impedance OFF-state. When the enable input (E) is HIGH all six outputs are switched to LOW. The outputs have a 2-TTL load drive capability.

Strobed hex inverter/buffer

The HEF4502B consists of six inverter/buffers with 3-state outputs. When the output enable input (EO) is HIGH all six outputs (O1to O6) are in the high impedance OFF-state. When the enable input (E) is HIGH all six outputs are switched to LOW. The outputs have a 2-TTL load drive capability.

Strobed hex inverter/buffer

The HEF4502B consists of six inverter/buffers with 3-state outputs. When the output enable input (EO) is HIGH all six outputs (O1to O6) are in the high impedance OFF-state. When the enable input (E) is HIGH all six outputs are switched to LOW. The outputs have a 2-TTL load drive capability.

POWER TRANSISTORS(30A,100V,200W)

30 AMPERE POWER TRANSISTOR PNP SILICON 100 VOLTS 200 WATTS

Silicon NPN epitaxial planer transistor

Silicon NPN epitaxial planar type For general amplification ■ Features • Two elements incorporated into one package • Reduction of the mounting area and assembly cost by one half