位置：首页 > IC中文资料第2616页 > CC330
| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
CC330x SimpleLink™ Wi-Fi® 6 and Bluetooth® Low Energy Transceiver 1 Features • Highly optimized Wi-Fi® 6 and Bluetooth® Low Energy 5.2 system for low-cost industrial embedded applications • Designed to integrate with any MPU or MCU host capable of running a TCP/IP stack • Wi-Fi 6 – MAC, baseband, and RF transceiver with support for IEEE 802.11 b/g/n/ax | TI 德州仪器 |   | ||
CC330x SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy companion IC 1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® low energy 5.4 in CC33x1 devices • Companion IC to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4 GHz PA for complete wireless solution with up to +20.5 dBm output power. • Operating temperature: -40°C | TI 德州仪器 | | ||
CC330x SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy companion IC 1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® low energy 5.4 in CC33x1 devices • Companion IC to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4 GHz PA for complete wireless solution with up to +20.5 dBm output power. • Operating temperature: -40°C | TI 德州仪器 | | ||
CC330x SimpleLink™ Wi-Fi® 6 and Bluetooth® Low Energy Transceiver 1 Features • Highly optimized Wi-Fi® 6 and Bluetooth® Low Energy 5.2 system for low-cost industrial embedded applications • Designed to integrate with any MPU or MCU host capable of running a TCP/IP stack • Wi-Fi 6 – MAC, baseband, and RF transceiver with support for IEEE 802.11 b/g/n/ax | TI 德州仪器 | | ||
CC330x SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy companion IC 1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® low energy 5.4 in CC33x1 devices • Companion IC to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4 GHz PA for complete wireless solution with up to +20.5 dBm output power. • Operating temperature: -40°C | TI 德州仪器 | | ||
CC330x SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy companion IC 1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® low energy 5.4 in CC33x1 devices • Companion IC to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4 GHz PA for complete wireless solution with up to +20.5 dBm output power. • Operating temperature: -40°C | TI 德州仪器 | | ||
CC330xMOD SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy Companion Module 1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® Low Energy 5.4 in CC33x1MOD • Companion module to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4GHz PA for a complete wireless system with up to +18.4dBm output power • Operating temperature: –40°C to + | TI 德州仪器 | | ||
CC330xMOD SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy Companion Module 1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® Low Energy 5.4 in CC33x1MOD • Companion module to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4GHz PA for a complete wireless system with up to +18.4dBm output power • Operating temperature: –40°C to + | TI 德州仪器 | | ||
CC330xMOD SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy Companion Module 1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth®Low Energy 5.4 in CC33x1MOD • Companion module to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4GHz PA for complete wireless system with up to +18dBm output power • Operating temperature: –40°C to +85°C | TI 德州仪器 | | ||
CC330x SimpleLink™ Wi-Fi® 6 and Bluetooth® Low Energy Transceiver 1 Features • Highly optimized Wi-Fi® 6 and Bluetooth® Low Energy 5.2 system for low-cost industrial embedded applications • Designed to integrate with any MPU or MCU host capable of running a TCP/IP stack • Wi-Fi 6 – MAC, baseband, and RF transceiver with support for IEEE 802.11 b/g/n/ax | TI 德州仪器 | | ||
CC330x SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy companion IC 1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® low energy 5.4 in CC33x1 devices • Companion IC to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4 GHz PA for complete wireless solution with up to +20.5 dBm output power. • Operating temperature: -40°C | TI 德州仪器 | | ||
CC330x SimpleLink™ Wi-Fi® 6 and Bluetooth® Low Energy Transceiver 1 Features • Highly optimized Wi-Fi® 6 and Bluetooth® Low Energy 5.2 system for low-cost industrial embedded applications • Designed to integrate with any MPU or MCU host capable of running a TCP/IP stack • Wi-Fi 6 – MAC, baseband, and RF transceiver with support for IEEE 802.11 b/g/n/ax | TI 德州仪器 | | ||
CC330x SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy companion IC 1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® low energy 5.4 in CC33x1 devices • Companion IC to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4 GHz PA for complete wireless solution with up to +20.5 dBm output power. • Operating temperature: -40°C | TI 德州仪器 | | ||
CC330x SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy companion IC 1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® low energy 5.4 in CC33x1 devices • Companion IC to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4 GHz PA for complete wireless solution with up to +20.5 dBm output power. • Operating temperature: -40°C | TI 德州仪器 | | ||
CC330x SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy companion IC 1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® low energy 5.4 in CC33x1 devices • Companion IC to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4 GHz PA for complete wireless solution with up to +20.5 dBm output power. • Operating temperature: -40°C | TI 德州仪器 | | ||
CC330xMOD SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy Companion Module 1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth®Low Energy 5.4 in CC33x1MOD • Companion module to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4GHz PA for complete wireless system with up to +18dBm output power • Operating temperature: –40°C to +85°C | TI 德州仪器 | | ||
CC330xMOD SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy Companion Module 1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® Low Energy 5.4 in CC33x1MOD • Companion module to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4GHz PA for a complete wireless system with up to +18.4dBm output power • Operating temperature: –40°C to + | TI 德州仪器 | | ||
CC330xMOD SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy Companion Module 1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® Low Energy 5.4 in CC33x1MOD • Companion module to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4GHz PA for a complete wireless system with up to +18.4dBm output power • Operating temperature: –40°C to + | TI 德州仪器 | | ||
CC330xMOD SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy Companion Module 1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth®Low Energy 5.4 in CC33x1MOD • Companion module to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4GHz PA for complete wireless system with up to +18dBm output power • Operating temperature: –40°C to +85°C | TI 德州仪器 | | ||
CC330x SimpleLink™ Wi-Fi® 6 and Bluetooth® Low Energy Transceiver 1 Features • Highly optimized Wi-Fi® 6 and Bluetooth® Low Energy 5.2 system for low-cost industrial embedded applications • Designed to integrate with any MPU or MCU host capable of running a TCP/IP stack • Wi-Fi 6 – MAC, baseband, and RF transceiver with support for IEEE 802.11 b/g/n/ax | TI 德州仪器 | | ||
CC330x SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy companion IC 1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® low energy 5.4 in CC33x1 devices • Companion IC to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4 GHz PA for complete wireless solution with up to +20.5 dBm output power. • Operating temperature: -40°C | TI 德州仪器 | | ||
CC330xMOD SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy Companion Module 1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth®Low Energy 5.4 in CC33x1MOD • Companion module to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4GHz PA for complete wireless system with up to +18dBm output power • Operating temperature: –40°C to +85°C | TI 德州仪器 | | ||
CC330xMOD SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy Companion Module 1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® Low Energy 5.4 in CC33x1MOD • Companion module to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4GHz PA for a complete wireless system with up to +18.4dBm output power • Operating temperature: –40°C to + | TI 德州仪器 | | ||
包装：盒 描述：RLY CONT 4P 500V 50/60HZ 2NO/2NC 继电器 接触器（机电） | ETC 知名厂家 | ETC | | |
包装：盒 描述：RLY CONT 4P 200VACDC 2NO/2NC 继电器 接触器（机电） | ETC 知名厂家 | ETC | | |
3-phase 3-line 500VAC Available 200-400A For output side only 文件：228.45 Kbytes Page：2 Pages | SOSHIN 双信电机 | | ||
SimpleLink™ Wi-Fi 6 配套模块 | TI 德州仪器 | | ||
SimpleLink™ Wi-Fi 6 和低功耗 Bluetooth® 配套 IC | TI 德州仪器 | | ||
SimpleLink™ Wi-Fi 6 和低功耗 Bluetooth® 配套模块 | TI 德州仪器 | | ||
SHIELDED SMT POWER INDUCTORS ● FEATURE Various high power inductor are Superior to be high saturation for surface mounting ● APPLICATIONS 2 DC/DC converter power supply, Telecommunication equipment | PRODUCTWELL | | ||
Ultra-Long-Life, Switching Power Grade Radial High Ripple and Ultra-Long Life 文件：365.57 Kbytes Page：5 Pages | CDE | | ||
High Ripple and Ultra-Long Life 文件：470.2 Kbytes Page：6 Pages | CDE | | ||
Clock Oscillators 文件：140.12 Kbytes Page：3 Pages | OSCILENT | | ||
Celeron D Processor 文件：1.75778 Mbytes Page：82 Pages | Intel 英特尔 | |
CC330产品属性
- 类型
描述
- 型号
CC330
- 制造商
Carlo Gavazzi
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
C2MRO |
24+ |
NA/ |
188 |
优势代理渠道,原装正品,可全系列订货开增值税票 |
|||
DIODES/美台 |
20+ |
SMD |
88800 |
DIODES原装优势主营型号-可开原型号增税票 |
|||
C2MICRO |
25+ |
BGA |
188 |
原装正品,假一罚十! |
|||
DIODES/美台 |
24+ |
NA |
30000 |
房间原装现货特价热卖,有单详谈 |
|||
原厂 |
原厂封装 |
385 |
一级代理 原装正品假一罚十价格优势长期供货 |
||||
MOLEX/莫仕 |
2508+ |
/ |
220083 |
一级代理，原装现货 |
|||
17 |
公司优势库存 热卖中!! |
||||||
ON/安森美 |
24+ |
SOT23-3 |
6618 |
公司现货库存,支持实单 |
|||
MOLEX |
1 |
全新原装 货期两周 |
|||||
TI/德州仪器 |
23+ |
10000 |
原厂授权一级代理,专业海外优势订货,价格优势、品种 |
CC330规格书下载地址
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CC330数据表相关新闻
CC430F5137IRGZR
CC430F5137IRGZR制造商：Texas Instruments
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2022-9-2CC3230SF12RGKR
CC3230SF12RGKR
2021-1-14CC3230SF12RGKR
RF微控制器- MCU SimpleLink Arm Cortex-M4 Wi-Fi MCU 256kB RAM+1MB XIP flash， coex， WPA3， 16 TLS sockets，secure boot
2021-1-5CC430F5137IRGZR
深圳好佳好科技有限公司 电话：0755-82559658 QQ：1728142002 本公司主营德州TI，原装正品现货，实单价格可谈，欢迎来电咨询！！！ 支持配单所有:电源IC，电阻电容电感，开关，USB，插口，二三极管，光藕系列，IC电子元件等等
2019-10-17CC3235SF12RGKRWi-Fi单芯片无线MCU解决方案
德州仪器（TI）的片上系统（SoC）解决方案在单个芯片中集成了两个处理器，以简化物联网设计
2019-9-5
DdatasheetPDF页码索引
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