型号 功能描述 生产厂家 企业 LOGO 操作
CC3301

CC330x SimpleLink™ Wi-Fi® 6 and Bluetooth® Low Energy Transceiver

1 Features • Highly optimized Wi-Fi® 6 and Bluetooth® Low Energy 5.2 system for low-cost industrial embedded applications • Designed to integrate with any MPU or MCU host capable of running a TCP/IP stack • Wi-Fi 6 – MAC, baseband, and RF transceiver with support for IEEE 802.11 b/g/n/ax

TI

德州仪器

CC3301

CC330x SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy companion IC

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® low energy 5.4 in CC33x1 devices • Companion IC to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4 GHz PA for complete wireless solution with up to +20.5 dBm output power. • Operating temperature: -40°C

TI

德州仪器

CC3301

SimpleLink™ Wi-Fi 6 和低功耗 Bluetooth® 配套 IC

TI

德州仪器

丝印代码:CC3301ENJA;CC330x SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy companion IC

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® low energy 5.4 in CC33x1 devices • Companion IC to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4 GHz PA for complete wireless solution with up to +20.5 dBm output power. • Operating temperature: -40°C

TI

德州仪器

CC330x SimpleLink™ Wi-Fi® 6 and Bluetooth® Low Energy Transceiver

1 Features • Highly optimized Wi-Fi® 6 and Bluetooth® Low Energy 5.2 system for low-cost industrial embedded applications • Designed to integrate with any MPU or MCU host capable of running a TCP/IP stack • Wi-Fi 6 – MAC, baseband, and RF transceiver with support for IEEE 802.11 b/g/n/ax

TI

德州仪器

CC330x SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy companion IC

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® low energy 5.4 in CC33x1 devices • Companion IC to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4 GHz PA for complete wireless solution with up to +20.5 dBm output power. • Operating temperature: -40°C

TI

德州仪器

CC330x SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy companion IC

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® low energy 5.4 in CC33x1 devices • Companion IC to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4 GHz PA for complete wireless solution with up to +20.5 dBm output power. • Operating temperature: -40°C

TI

德州仪器

CC330xMOD SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy Companion Module

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® Low Energy 5.4 in CC33x1MOD • Companion module to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4GHz PA for a complete wireless system with up to +18.4dBm output power • Operating temperature: –40°C to +

TI

德州仪器

CC330xMOD SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy Companion Module

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth®Low Energy 5.4 in CC33x1MOD • Companion module to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4GHz PA for complete wireless system with up to +18dBm output power • Operating temperature: –40°C to +85°C

TI

德州仪器

CC330xMOD SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy Companion Module

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth®Low Energy 5.4 in CC33x1MOD • Companion module to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4GHz PA for complete wireless system with up to +18dBm output power • Operating temperature: –40°C to +85°C

TI

德州仪器

CC330xMOD SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy Companion Module

1 Features Key Features • Wi-Fi 6 (802.11ax) • Bluetooth® Low Energy 5.4 in CC33x1MOD • Companion module to any processor or MCU host capable of running a TCP/IP stack • Integrated 2.4GHz PA for a complete wireless system with up to +18.4dBm output power • Operating temperature: –40°C to +

TI

德州仪器

SimpleLink™ Wi-Fi 6 和低功耗 Bluetooth® 配套模块

TI

德州仪器

Insulated Gate Bipolar Transistor N-Channel Enhancement Mode, High Speed Switch

Features: ● High Input Impedance ● Low Saturation Voltage ● Enhancement Mode ● 20V Gate Drive Applications: ● High Power Switching ● Motor Control

NTE

SECOND SOURCE T-1 3/4 SOLID STATE LAMPS

文件:199.57 Kbytes Page:3 Pages

QT

LM2900/LM3900/LM3301 Quad Amplifiers

文件:323.8 Kbytes Page:20 Pages

NSC

国半

LM2900/LM3900/LM3301 Quad Amplifiers

文件:323.8 Kbytes Page:20 Pages

NSC

国半

SUBMINIATURE PHOTOINTERRUPTER

文件:55.62 Kbytes Page:3 Pages

UOT

东贝光电

更新时间:2026-3-14 10:45:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
DIODES/美台
25+
NA
30000
房间原装现货特价热卖,有单详谈
MOLEX/莫仕
26+
NA
360000
只做原装
TI/德州仪器
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
TI/德州仪器
25+
原厂封装
9999
MOLEX/莫仕
2508+
/
220083
一级代理,原装现货
TI/德州仪器
25+
原厂封装
10000
24+
N/A
46000
一级代理-主营优势-实惠价格-不悔选择
IR
22+
TO-220-5
6000
终端可免费供样,支持BOM配单
TI
25+
WQFN-40-EP(5x5)
7786
正规渠道,免费送样。支持账期,BOM一站式配齐
TI
25+
WQFN-40-EP(5x5)
7786
正规渠道,免费送样。支持账期,BOM一站式配齐

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