型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
---|---|---|---|---|
CC2642R | CC2652PSIP SimpleLink??Multiprotocol 2.4-GHz Wireless System-in-Package With Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4F processor • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • Dynamic multiprotocol manager ( | TI 德州仪器 | ||
CC2642R | CC2642R-Q1 SimpleLink™ Bluetooth® 5.2 Low Energy Wireless MCU 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • EEMBC CoreMark® score: 148 • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • 2- | TI 德州仪器 | ||
CC2642R | CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU with Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI 德州仪器 | ||
CC2642R | CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI1 德州仪器 | ||
CC2642R | CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI1 德州仪器 | ||
CC2642R | CC2340R5-Q1 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • AEC-Q100 Grade 2 qualified for Automotive applications • Optimized 48-MHz Arm® Cortex®-M0+ processor • 512 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 36 KB of ultra-low leakage SRAM. Full RAM retention in standby mod | TI1 德州仪器 | ||
CC2642R | CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3 | TI1 德州仪器 | ||
CC2642R | CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3 | TI1 德州仪器 | ||
CC2642R | CC1314R10 SimpleLink™ High-Performance Sub-1GHz Wireless MCU 1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis | TI1 德州仪器 | ||
CC2642R | CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis | TI1 德州仪器 | ||
CC2642R | CC2651P3 SimpleLink??Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier 文件:3.51768 Mbytes Page:63 Pages | TI 德州仪器 | ||
CC2642R | CC2642R-Q1 SimpleLink??Bluetooth짰 5.1 Low Energy Wireless MCU 文件:1.21398 Mbytes Page:61 Pages | TI1 德州仪器 | ||
CC2642R | SimpleLink Bluetooth 5 low energy Wireless MCU 文件:1.01677 Mbytes Page:45 Pages | TI1 德州仪器 | ||
CC2642R | CC2652R7 SimpleLink??Multiprotocol 2.4 GHz Wireless MCU 文件:2.90059 Mbytes Page:58 Pages | TI 德州仪器 | ||
CC2642R-Q1 SimpleLink™ Bluetooth® 5.2 Low Energy Wireless MCU 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • EEMBC CoreMark® score: 148 • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • 2- | TI 德州仪器 | |||
CC2642R-Q1 SimpleLink™ Bluetooth® 5.2 Low Energy Wireless MCU 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • EEMBC CoreMark® score: 148 • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • 2- | TI 德州仪器 | |||
CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI1 德州仪器 | |||
CC2340R5-Q1 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • AEC-Q100 Grade 2 qualified for Automotive applications • Optimized 48-MHz Arm® Cortex®-M0+ processor • 512 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 36 KB of ultra-low leakage SRAM. Full RAM retention in standby mod | TI1 德州仪器 | |||
CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU with Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI 德州仪器 | |||
CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3 | TI1 德州仪器 | |||
CC1314R10 SimpleLink™ High-Performance Sub-1GHz Wireless MCU 1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis | TI1 德州仪器 | |||
CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3 | TI1 德州仪器 | |||
CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU 1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl | TI1 德州仪器 | |||
CC2652PSIP SimpleLink??Multiprotocol 2.4-GHz Wireless System-in-Package With Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4F processor • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • Dynamic multiprotocol manager ( | TI 德州仪器 | |||
CC2642R-Q1 SimpleLink™ Bluetooth® 5.2 Low Energy Wireless MCU 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • EEMBC CoreMark® score: 148 • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • 2- | TI 德州仪器 | |||
CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis | TI1 德州仪器 | |||
CC2642R-Q1 SimpleLink™ Bluetooth® 5.2 Low Energy Wireless MCU 1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • EEMBC CoreMark® score: 148 • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • 2- | TI 德州仪器 | |||
SimpleLink Bluetooth 5 low energy Wireless MCU 文件:1.01677 Mbytes Page:45 Pages | TI1 德州仪器 | |||
SimpleLink Bluetooth 5 low energy Wireless MCU 文件:1.01677 Mbytes Page:45 Pages | TI1 德州仪器 | |||
封装/外壳:48-VFQFN 裸露焊盘 包装:管件 描述:IC RF TXRX+MCU BLE 5.2 48VQFN RF/IF,射频/中频和 RFID 射频收发器 IC | TI2 德州仪器 | |||
SimpleLink Bluetooth 5 low energy Wireless MCU 文件:1.01677 Mbytes Page:45 Pages | TI1 德州仪器 | |||
封装/外壳:48-VFQFN 裸露焊盘 包装:卷带(TR) 描述:AUTOMOTIVE QUALIFIED SIMPLELINK RF/IF,射频/中频和 RFID 射频收发器 IC | TI2 德州仪器 | |||
CC2642R-Q1 SimpleLink??Bluetooth짰 5.1 Low Energy Wireless MCU 文件:1.21398 Mbytes Page:61 Pages | TI1 德州仪器 | |||
CC2642R-Q1 SimpleLink??Bluetooth짰 5.1 Low Energy Wireless MCU 文件:1.21398 Mbytes Page:61 Pages | TI1 德州仪器 | |||
CC2642R-Q1 SimpleLink??Bluetooth짰 5.1 Low Energy Wireless MCU 文件:1.21398 Mbytes Page:61 Pages | TI1 德州仪器 | |||
CC2652R7 SimpleLink??Multiprotocol 2.4 GHz Wireless MCU 文件:2.90059 Mbytes Page:58 Pages | TI 德州仪器 | |||
CC2651P3 SimpleLink??Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier 文件:3.51768 Mbytes Page:63 Pages | TI 德州仪器 | |||
FL SWITCH SFNB 文件:340.02 Kbytes Page:7 Pages | PhoenixPHOENIX CONTACT 菲尼克斯电气德国菲尼克斯电气集团 | |||
nternally Matched LNA Module 文件:195.56 Kbytes Page:1 Pages | ASI | |||
Internally Matched LNA Module 文件:123.04 Kbytes Page:1 Pages | ASB | |||
Graphite Brush 文件:490.45 Kbytes Page:1 Pages | ASSUN | |||
METAL Brush 文件:512.86 Kbytes Page:1 Pages | ASSUN |
IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
TI(德州仪器) |
24+ |
标准封装 |
17048 |
原厂直销,大量现货库存,交期快。价格优,支持账期 |
|||
Texas Instruments |
24+ |
VQFN-48 |
3265 |
全新原厂原装,进口正品现货,正规渠道可含税!! |
|||
TI |
23+ |
QFN |
17566 |
原厂原装 |
|||
TI(德州仪器) |
23+ |
13650 |
公司只做原装正品,假一赔十 |
||||
NA |
23+ |
NA |
26094 |
10年以上分销经验原装进口正品,做服务型企业 |
|||
TI/德州仪器 |
25+ |
QFN-48 |
32360 |
TI/德州仪器全新特价CC2642R1FRGZR即刻询购立享优惠#长期有货 |
|||
TI |
2年内 |
NA |
15000 |
英博尔原装优质现货订货渠道商 |
|||
TI |
23+ |
QFN |
50000 |
只做原装正品 |
|||
TI/德州仪器 |
24+ |
QFN48 |
55000 |
只做原装,支持实单 |
|||
TI |
25+ |
QFN-48 |
10000 |
公司优势品牌:EXAR 西伯斯/SMSC 半磁半导体/ MAXIM
美国美信/TI/BB德州仪/器STC宏晶科技/ATMEL爱特梅尔
SONIX松翰NXP恩智浦ST意法半导体FTDI /SILICON
/ICPLUS/JRC |
CC2642R规格书下载地址
CC2642R参数引脚图相关
- cw7805
- cs5532
- cs1
- cpld
- cp10
- connector
- cob
- cmos传感器
- cmos
- cm2006
- cicret
- cd4543
- cd4066
- cd4051
- cd4046
- cd4011
- CCFL
- ccd图像传感器
- ccd传感器
- CCD
- CC3135
- CC3130
- CC3120
- CC3100
- CC3000
- CC2D35S
- CC2D35
- CC2D33S
- CC2D33
- CC2D25S
- CC2D25
- CC2D23S
- CC2D23
- CC2A35
- CC2A33
- CC2A25
- CC2A23
- CC2652R
- CC2652P
- CC2650F128RHBR
- CC2650F128RGZT
- CC2650F128RGZR
- CC2650EMK-7ID
- CC2650EMK-5XD
- CC2650EMK-4XS
- CC2650DK
- CC2650_16
- CC2650_15
- CC2650
- CC2649-000
- CC2646-000
- CC2642R-Q1_V01
- CC2642R-Q1
- CC2642R1TWFRTCRQ1
- CC2642R1TWFRTCQ1
- CC2642R1FTWRGZRQ1
- CC2642R1FRGZT
- CC2642R1FRGZR
- CC2642R1FRGZ
- CC2640R2LRHBR
- CC2640R2LRHB
- CC2640R2LRGZR
- CC2640R2LRGZ
- CC2640R2L
- CC2640R2FYFVT
- CC2640R2FYFVR
- CC2640R2FTWRGZTQ1
- CC2640R2FTWRGZRQ1
- CC2640R2FTWRGZQ1
- CC2640R2FRSMT
- CC2640R2FRSMR
- CC2640R2FRHBT
- CC2640R2FRHBR
- CC2640R2FRGZT
- CC2640R2FRGZR
- CC2640R2F-Q1
- CC2640R2F
- CC2640F128RSMT
- CC2640F128RSMR
- CC2640
- CC2630
- CC2620
- CC25TTE
- CC2595
- CC2592
- CC2591
- CC2590
- CC2571
- CC2570
- CC256X
- CC2564C
- CC2564B
- CC2564
- CC2560B
- CC2560A
- CC2560
- CC2550
- CC2545
- CC2544
CC2642R数据表相关新闻
CC2640R2FRHBR
CC2640R2FRHBR
2023-8-21CC2652P74T0RGZR
CC2652P74T0RGZR
2023-4-23CC3120MODRNMMOBR
www.58chip.com
2022-4-26CC2640R2FTWRGZRQ1
说明:射频微控制器 - MCU Autom Qualified SimpleLink Bluetooth
2021-11-26CC2650F128RHBR收发器封装QFN32原装现货18138231376
联系人:刘冬英 电话:0755-83203002 手机:18138231376 QQ号:1546282226、微信号:18138231376 公司名称:深圳市光华微科技有限公司 Shenzhen Guanghua Micro Technology Co., Ltd 公司地址:深圳市福田区振兴路华匀大厦1栋712室
2019-10-10CC2640R2FRSMRSimpleLinkBluetooth?低耗能无线MCU:
原装正品,价格优势,竭力为您服务 0755-88600196/QQ3007281353
2019-6-24
DdatasheetPDF页码索引
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