位置:首页 > IC中文资料 > CC2640R2FRG

型号 功能描述 生产厂家 企业 LOGO 操作

CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

TI

德州仪器

丝印代码:CC2640R2F;CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

TI

德州仪器

丝印代码:CC2640R2F;CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

TI

德州仪器

丝印代码:CC2640R2F;CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

TI

德州仪器

丝印代码:CC2640R2F;CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

TI

德州仪器

丝印代码:CC2640R2F;CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

TI

德州仪器

丝印代码:CC2640R2F;CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

TI

德州仪器

丝印代码:CC2640R2F;CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

TI

德州仪器

丝印代码:CC2640R2F;CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

TI

德州仪器

丝印代码:CC2640R2F;CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

TI

德州仪器

SimpleLink Bluetooth low energy Wireless MCU

文件:1.97981 Mbytes Page:64 Pages

TI

德州仪器

封装/外壳:48-VFQFN 裸露焊盘 包装:管件 描述:IC RF TXRX+MCU BLUETOOTH 48VFQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

SimpleLink Bluetooth low energy Wireless MCU

文件:1.97981 Mbytes Page:64 Pages

TI

德州仪器

封装/外壳:48-VFQFN 裸露焊盘 包装:托盘 描述:IC RF TXRX+MCU BLE 5.1 48VQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

TI

德州仪器

SimpleLink Bluetooth low energy Wireless MCU

文件:1.97981 Mbytes Page:64 Pages

TI

德州仪器

SimpleLink Bluetooth low energy Wireless MCU

文件:1.97981 Mbytes Page:64 Pages

TI

德州仪器

SimpleLink Bluetooth low energy Wireless MCU

文件:1.97981 Mbytes Page:64 Pages

TI

德州仪器

SimpleLink Bluetooth low energy Wireless MCU

文件:1.97981 Mbytes Page:64 Pages

TI

德州仪器

更新时间:2026-3-18 19:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
Texas Instruments
24+
VQFN-48
3265
全新原厂原装,进口正品现货,正规渠道可含税!!
TI(德州仪器)
23+
NA
20094
正纳10年以上分销经验原装进口正品做服务做口碑有支持
TI
22+
48VFQFN
9000
原厂渠道,现货配单
TI(德州仪器)
2021+
VQFN-48(7x7)
499
TI/德州仪器
24+
N/A
20000
原厂直供原装正品
TI/德州仪器
23+
VQFN-48
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
TI/德州仪器
1843
VQFN48
527
TI
18+
QFN32
85600
保证进口原装可开17%增值税发票
TI
24+
VQFN
17900
一级授权代理原装现货热卖
TI/德州仪器
2026+
VQFN48
65248
百分百原装现货 实单必成

CC2640R2FRG数据表相关新闻