型号 功能描述 生产厂家 企业 LOGO 操作
CC1350F128RHB

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

CC1350F128RHB

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:1.0034 Mbytes Page:61 Pages

TI

德州仪器

丝印代码:CC1350F128;CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

丝印代码:CC1350F128;CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

丝印代码:CC1350F128;CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

丝印代码:CC1350F128;CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:1.0034 Mbytes Page:61 Pages

TI

德州仪器

封装/外壳:32-VFQFN 裸露焊盘 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:IC RF TXRX+MCU 802.15.4 32VFQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

封装/外壳:32-VFQFN 裸露焊盘 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:IC RF TXRX+MCU 802.15.4 32VFQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:1.0034 Mbytes Page:61 Pages

TI

德州仪器

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:1.0034 Mbytes Page:61 Pages

TI

德州仪器

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:799.63 Kbytes Page:52 Pages

TI

德州仪器

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:799.63 Kbytes Page:52 Pages

TI

德州仪器

更新时间:2026-3-15 16:38:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI
21+
VQFN32
8080
只做原装,质量保证
原装TI
24+
QFN32
5000
全新原装正品,现货销售
TI
26+
32-VFQF
86720
全新原装正品价格最实惠 承诺假一赔百
TI
23+
VQFN32
5000
全新原装,支持实单,非诚勿扰
TI
25+
N/A
11580
原装正品现货,原厂订货,可支持含税原型号开票。
TI
16+
VQFN
10000
原装正品
TI
24+
VQFN
17900
一级授权代理原装现货热卖
TI/德州仪器
25+
VQFN32
32360
TI/德州仪器全新特价CC1350F128RHBR即刻询购立享优惠#长期有货
TI
19+
VQFN32
10000
只做原装正品,卖元器件不赚钱交个朋友
TI
23+
VQFN32
12800
公司只有原装 欢迎来电咨询。

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