型号 功能描述 生产厂家 企业 LOGO 操作
CC1350F128RHB

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

CC1350F128RHB

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:1.0034 Mbytes Page:61 Pages

TI

德州仪器

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

封装/外壳:32-VFQFN 裸露焊盘 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:IC RF TXRX+MCU 802.15.4 32VFQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:1.0034 Mbytes Page:61 Pages

TI

德州仪器

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:1.0034 Mbytes Page:61 Pages

TI

德州仪器

封装/外壳:32-VFQFN 裸露焊盘 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:IC RF TXRX+MCU 802.15.4 32VFQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:1.0034 Mbytes Page:61 Pages

TI

德州仪器

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:1.0034 Mbytes Page:61 Pages

TI

德州仪器

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:799.63 Kbytes Page:52 Pages

TI

德州仪器

更新时间:2025-12-17 23:01:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI(德州仪器)
24+
QFN32EP(5x5)
1083
只做原装,提供一站式配单服务,代工代料。BOM配单
TI/德州仪器
24+
NA/
2179
优势代理渠道,原装正品,可全系列订货开增值税票
TI/德州仪器
25+
VQFN32
32360
TI/德州仪器全新特价CC1350F128RHBR即刻询购立享优惠#长期有货
TI(德州仪器)
23+
NA
20094
正纳10年以上分销经验原装进口正品做服务做口碑有支持
TI
23+
NA
20000
TI
22+
5000
只做原装鄙视假货15118075546
TI
23+
VQFN32
5000
全新原装,支持实单,非诚勿扰
TI/德州仪器
23+
10000
原厂授权一级代理,专业海外优势订货,价格优势、品种
原装TI
24+
QFN32
5000
全新原装正品,现货销售
TI
21+
VQFN32
8080
只做原装,质量保证

CC1350F128RHB数据表相关新闻