型号 功能描述 生产厂家 企业 LOGO 操作
CC1310F128RHB

CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

丝印代码:CC1310F128;CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

丝印代码:CC1310F128;CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

丝印代码:CC1310F128;CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

丝印代码:CC1310F128;CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

丝印代码:CC1310F128;CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

丝印代码:CC1310F128;CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

TI

德州仪器

丝印代码:CC1310F128;SimpleLink Ultralow Power Sub-1-GHz Wireless MCU

文件:1.47595 Mbytes Page:54 Pages

TI

德州仪器

封装/外壳:32-VFQFN 裸露焊盘 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:IC RF TXRX+MCU ISM\u003c1GHZ 32VFQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

丝印代码:CC1310F128;SimpleLink Ultralow Power Sub-1-GHz Wireless MCU

文件:1.47595 Mbytes Page:54 Pages

TI

德州仪器

封装/外壳:32-VFQFN 裸露焊盘 包装:托盘 描述:IC RF TXRX+MCU ISM\u003c1GHZ 32VFQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

丝印代码:CC1310F128;SimpleLink Ultralow Power Sub-1-GHz Wireless MCU

文件:1.47595 Mbytes Page:54 Pages

TI

德州仪器

丝印代码:CC1310F128;SimpleLink Ultralow Power Sub-1-GHz Wireless MCU

文件:1.47595 Mbytes Page:54 Pages

TI

德州仪器

丝印代码:CC1310F128;SimpleLink Ultralow Power Sub-1-GHz Wireless MCU

文件:1.47595 Mbytes Page:54 Pages

TI

德州仪器

丝印代码:CC1310F128;SimpleLink Ultralow Power Sub-1-GHz Wireless MCU

文件:1.47595 Mbytes Page:54 Pages

TI

德州仪器

更新时间:2026-3-14 20:00:00
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TI(德州仪器)
25+
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2152+
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原装正品假一罚十
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郑重承诺只做原装进口现货
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原装正品代理渠道价格优势

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