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C201价格
参考价格：￥0.3498
型号：C2012C0G1E103J060AA 品牌：TDK 备注：这里有C201多少钱，2025年最近7天走势，今日出价，今日竞价，C201批发/采购报价，C201行情走势销售排行榜，C201报价。| 型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
|---|---|---|---|---|
C201 | 50WATTS(AC)DC/DCSINGLEIOUTPUT Features •SingleOutput •3Ux10TEx165mm8TE:uponrequest •Weight0.7kg) | POWERBOX Powerbox manufactures |  |   |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 |  | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MultilayerCeramicChipCapacitorsGeneraluse Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MultilayerCeramicChipCapacitorsGeneraluse Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MultilayerCeramicChipCapacitorsGeneraluse Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORSCommercialgrade,general(Upto75V) ■SERIESOVERVIEW GeneraltypeCseriesisasurface-mountedcomponent,whichmultilayerdielectricsandinnerelectrodesarestackedalternately.Themonolithic structureensuressuperiormechanicalstrengthandhighreliability.Also,outstandingfrequencycharacteristicssuchaslowESRandlo | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MultilayerCeramicChipCapacitors Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MultilayerCeramicChipCapacitors Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MultilayerCeramicChipCapacitors Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MultilayerCeramicChipCapacitors CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MultilayerCeramicChipCapacitors CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MultilayerCeramicChipCapacitors CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MultilayerCeramicChipCapacitors CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MultilayerCeramicChipCapacitors Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MultilayerCeramicChipCapacitors Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MultilayerCeramicChipCapacitors Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
ADS78/8505EVMUsersGuide Features ·Full-FeaturedEvaluationBoardfortheADS7804,ADS7805orADS8505,parallelAnalogtoDigital Converters ·IndustryStandard±10VAnalogInputRange ·Builtinreference ·ParallelInterfacewith3-stateoutputdrivers ·Compatiblewiththe5-6KInterfaceBoardforusewithava | TITexas Instruments 德州仪器美国德州仪器公司 |  | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
CeramicCapacitorsForGeneralUseSMD Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
TDKintroducesanewglobalcatalogpartnumberforitsMultilayerCeramicCapacitorproducts Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
CeramicCapacitorsForGeneralUseSMD Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
CeramicCapacitorsForGeneralUseSMD Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
CeramicCapacitorsForGeneralUseSMD Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
CeramicCapacitorsForGeneralUseSMD Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C201产品属性
- 类型
描述
- 型号
C201
- 制造商
Thomas & Betts
- 功能描述
Universal Recessed Box And Cover
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
EWP |
23+ |
SMD |
8650 |
受权代理!全新原装现货特价热卖! |
|||
TDK |
22+ |
DNA |
5305 |
公司现货,有挂就有货。 |
|||
TDK |
19+ |
SMD |
18000 |
||||
TDK |
21+ |
10560 |
十年专营,原装现货,假一赔十 |
||||
TDK |
24+ |
SMD |
5286 |
公司现货库存,有挂就有货,支持实单 |
|||
TDK/东电化 |
2021+ |
2012 |
9000 |
原装现货,随时欢迎询价 |
|||
TDK(东电化) |
2021/2022+ |
标准封装 |
40000 |
原厂原装现货订货价格优势终端BOM表可配单提供样品 |
|||
2015+ |
3 |
公司现货库存 |
|||||
JXK/杰信科 |
23+ |
TO-92 |
999999 |
原厂授权一级代理,专业海外优势订货,价格优势、品种 |
|||
YAGEO |
24+ |
SMD |
80000 |
只做自己库存,全新原装进口正品假一赔百,可开13%增 |
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- C200X100APT
- C200X100A0T
- C200X050YJJ
- C200N50Z4
- C200HWSLK23
- C200HWPCS01EV1
- C200HWNC213
- C200HWCOM02V1
- C200HWCE002
- C200HWBI101V1
- C200HWBI051
- C200HWBI031
- C200HTS101
- C200HS-SLK22
- C200H-SP001
- C200HPRO27E
- C200HOD501
- C2008
- C2004A
- C2003A
- C2000
- C1Z91B
- C1Z9.1B
- C1Z82B
- C1Z8.2B
- C1Z75B
- C1Z7.5B
- C1Z68B
- C1Z62B
- C1Z6.8B
- C1Z6.2B
- C1Z56B
- C1Z51B
- C1Z50B
- C1Z5.6B
- C1Z5.1B
- C1Z47B
C201数据表相关新闻
C315C105K3R5TA
C315C105K3R5TA
2023-10-10C19D903205P1375
C19D903205P1375OTHER20+标准封装 C8051F001SILICONLABS20+标准封装 C8051F023-GQSILICONLABS20+标准封装 CAT24C04WICATALYSTSEMICONDUCTOR20+标准封装 CAT24C08WI-GT3CATALYSTSEMICONDUCTOR20+标准封装 CAT28F010G-12(PROG)OTHER20+标准封装 CMCPCI102BRCALIFORNIAMICRODEVICES20+标准封装 CP
2021-6-5C2M0040120D 碳化硅功率MOSFET SIC 深圳市正纳电子有限公司
C2M0040120D
2020-12-23C1CB00002620
C1CB00002620,当天发货0755-82732291全新原装现货或门市自取.
2020-11-11C17AH，C18003，C18005(104-022-B)，C1806，C1808DKNPOEBN6R0
C17AH，C18003，C18005(104-022-B)，C1806，C1808DKNPOEBN6R0
2020-4-3C2012X5R1A225M-60毫安稳压电荷泵电压逆变器
TPS6040x是一个系列器件产生一个不受管制的负输出电压的输入电压范围从1.6V至5.5V的设备通常提供了5V或3.3V由于preregulated供应铁路宽输入电压范围，两个或三个镍镉，镍氢电池或碱性电池，以及一个锂离子电池动力的。只有三个外部1μF电容需要构建一个完整的电荷泵DC/DC逆变器。组装在5引脚SOT23封装，完整的转换器，可以建在一个50平方毫米的电路板面积。额外的电路板面积元件数量的减少是通过取代肖特基二极管，通常需要启动成积体电路的负荷。TPS6040x能够以一个典型的转换效率，更大的一个最大输出电流60毫安在很宽的输出电流范围内超过90％。3与20千赫，5
2012-12-28
DdatasheetPDF页码索引
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